AIM to Highlight M8 at SMTA Intermountain (Boise) Expo & Tech Forum on April 7th, 2016

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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce they will highlight their revolutionary M8 solder paste along with their full line of solder assembly materials at the 2016 SMTA Intermountain (Boise) Expo and Tech Forum, scheduled to take place April 7th, 2016 at the Boise State University located in Boise, Idaho. In addition, AIM’s Technical Marketing Manager, Timothy O’Neill will present his white paper, “A Practical Guide to Optimizing Solder Paste Performance for Ultra-Fine Feature Printing” at the expo from 9:15am – 10:00am.

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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation at the 2016 SMTA Intermountain (Boise) Expo and Tech Forum, scheduled to take place April 7th, 2016 at the Boise State University located in Boise, Idaho. AIM will highlight their revolutionary M8 solder paste along with their full line of solder assembly materials. In addition, AIM’s Technical Marketing Manager, Timothy O’Neill will present his white paper, “A Practical Guide to Optimizing Solder Paste Performance for Ultra-Fine Feature Printing” at the expo from 9:15am – 10:00am.

M8 No Clean Solder Paste has been formulated to address the most demanding requirements confronting today’s SMT assembly market. M8 is proven to improve production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on QFN and LED packages. M8's post-reflow residue passes all IPC, BONO and tough changing environment test specifications, making it the ideal choice for automotive and high performance/high reliability applications. M8’s robust characteristics and stable performance improves every facet of the PCB assembly process.

O’Neill’s presentation will provide a detailed explanation of how to optimize solder paste performance from receiving to reflow. O’Neill will cover various topics such as paste handling, stencil design, printer setup and common defects. His presentation incorporates theory with best practice to inform the process engineer of the how, what and why of solder paste use.

Additionally, AIM will highlight its liquid fluxes, tin/lead and lead-free alloys, including SN100C. To discover all of AIM’s products and services, including lead-free and halogen-free solder, visit the company at the SMTA Dallas Expo & Tech Forum or http://www.aimsolder.com for more information.

About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit http://www.aimsolder.com.

Upcoming Events:
April 14, 2016 – SMTA Monterrey – Monterrey, Mexico
April 20, 2016 – SMTA Atlanta – Duluth, Georgia
April 26 – 28, 2016 – SMT Hybrid – Nuremberg, Germany

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Jeffrey Winchell
AIM Solder
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