Together, these technology centers develop products and services that address full-system interconnect challenges and offer strategic support at every level.
Louisville, KY (PRWEB) April 29, 2016
Samtec is proud to announce the opening of an interconnect design and development center in the Chicago, IL suburb of Lisle. This office is a critical element of Samtec’s future product development and technology roadmap, and recruitment for staff at this new facility is rapidly underway.
Selected for its central location and impressive electromechanical local talent pool, the Chicagoland office will join that ranks of Samtec’s Silicon Valley Optics Design Center, Pacific Northwest High Speed Cable Plant, Microelectronics Group in Colorado Springs, Advanced Interconnect Design Groups spanning three continents, and Signal Integrity Group and Teraspeed Consulting in the Northeastern United States. Skill sets across all of these areas of expertise are being sought for the Chicagoland office in order to build a truly cross-functional and integrated team.
Together, these technology centers develop products and services that address full-system interconnect challenges and offer strategic support at every level. They support Samtec’s mission to help designers optimize the high-speed signal path from the bare die, to IC package and assembly, to the PCB, to connectors and cable assemblies, and back again.
Capabilities include optimizing power and signal integrity of the bare die during the IC design process; developing customized IC packaging and assembly solutions enabling maximum IC density and efficiency; enabling PCB designers to create denser and faster PCBs by providing support to ensure signal chain optimization; providing the products and design expertise to link high-speed signal chains between PCBs and through backplanes; and to engineer industry standard and customized copper and optical cable assemblies at data rates up to 56Gbps and beyond.
The Chicagoland office, which is looking to immediately staff Product Design Engineers, Manufacturing Engineers, Signal Integrity Engineers, and an Engineering Manager, will be central to this effort in more than the geographic sense.
Founded in 1976, Samtec (http://www.samtec.com) is a privately held, $626 million global manufacturers of a broad line of electronic interconnect solution blocks, including IC-to-Board/Ultra Micro, High Speed Board-to-Board, High Speed Cables, Future-Proof/Active Optics, Flexible Stacking, and Micro/Rugged components and cables. To meet the interconnect challenges of tomorrow and beyond, Samtec has developed unique Technology Centers to help optimize the entire signal transmission path… from the IC to the panel and beyond, and all points in between