Samtec Expands ExaMAX® High-Speed Backplane Connector System

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Growing portfolio includes new wafer sizes and power and guidance modules

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Samtec’s expansion of our ExaMAX® High-Speed Backplane Connector System provides engineers increased options as they consider current and future high-speed backplane architectures.

Samtec, a privately held $625MM global manufacturer of a broad line of electronic interconnect solutions, proudly announces the expansion of the ExaMAX® High-Speed Backplane Connector System optimized for high-density and high-speed performance. The scalable ExaMAX® system meets today’s data rates while providing a future-proof path for next generation architectures.

The ExaMAX® header and right-angle receptacle system (EBTM/EBTF-RA Series) is optimized for speeds up to 28 Gbps on a 2.00 mm column pitch or 56 Gbps on a 3.00 mm column pitch. For 28 Gbps performance, this system meets and exceeds OIF-CEI-28G-LR specifications. Return loss compliance is achieved in both 85 Ω and 100 Ω systems due to targeting the 92 Ω specifications and controlling reflections at all geometry transitions within the connector.

Samtec’s highly-reliable ExaMAX® system has the industry’s lowest mating force with excellent normal force and meets Telcordia GR-1217 CORE specifications. With two reliable points of contact at all times, even when subjected to angled mating, residual stub is minimized for improved signal integrity performance. A 2.4 mm contact wipe increases reliability while the hermaphroditic mating interface ensures stub-free mating and reliable alignment.

The backplane system features individual signal wafers with differential pairs in a staggered design and arranged in columns with zero skew. Each wafer includes a one-piece embossed ground structure, which increases isolation to significantly decrease crosstalk. The 2.00 mm-pitch, 40-differential-pair design (4 pairs x 10 columns) and the 72-differential-pair design (6 pairs x 12 columns) are now available. A 3.00 mm-column-pitch design for 56 Gbps performance is in development.

Optional add-on power modules support high current delivery with current ratings as high as 80 A per module. Hot-swapping support comes from various pin staging options for detecting shorts. Optional discrete guidance modules are available to assist with blind mating. Ruggedized construction enables support for maximum weight in a space saving design.

“Samtec’s expansion of our ExaMAX® High-Speed Backplane Connector System provides engineers increased options as they consider current and future high-speed backplane architectures,” says Rick Skees, Samtec’s High-Speed Backplane Product Manager. “These new additions to our ExaMAX® portfolio will not be our last. We are currently developing new options for various orientations including coplanar, mid-plane orthogonal and direct-mate orthogonal (DMO.)”

To learn more about the ExaMAX® High-Speed Backplane Connector System, please watch the “Expanding the Backplane Ecosystem” webinar, download our ExaMAX® eBrochure or visit http://www.samtec.com/examax.

About Samtec, Inc.
Founded in 1976, Samtec is a privately held, $625MM global manufacturer of a broad line of electronic interconnect solutions, including IC-to-Board and IC Packaging, High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 33 locations in 18 different countries, Samtec’s global presence enables its unmatched customer service. For more information, please visit http://www.samtec.com.

Samtec, Inc.,
P.O. Box 1147
New Albany, IN 47151-1147
USA
Phone: 1-800-SAMTEC-9 (800-726-8329)
http://www.samtec.com

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