Cranston, RI USA (PRWEB) September 25, 2017
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Karl Seelig, VP of Technology, will present the white paper “New Pb-Free Solder Alloy for Demanding Applications” at SMTA Guadalajara 2017, scheduled to take place on October 18th – October 19th, 2017 at the Hotel Riu Plaza Guadalajara in Guadalajara, Jal, Mexico.
Seelig’s paper explores industry need for solder alloys that can perform in harsh service conditions and examines potential solutions. Applications such as high performance LED lighting and automotive applications require solder alloys to operate at high temperatures where commonly used SAC305 may be prone to failure. The challenges potential new high-reliability alloys present are associated with processing and manufacturability difficulties. This study’s focus is a new Sn-Ag-Cu-Bi-X solder alloy (X represents micro alloying dopants) with favorable processing capabilities and significant improvements in reliability. The study demonstrates how the new multi-component solder alloy, which provides improved thermo-mechanical performance, can be an ideal solder material for severe operating environment applications.
Additionally, AIM will highlight its full line of advanced solder materials, including its newly developed high reliability alloys, REL61™ and REL22™, its solder paste, liquid flux and solder alloys. REL61 addresses the most challenging issues with today’s common lead-free alloys, specifically soldering performance, cost, durability and tin whiskers. To discover all of AIM’s products and services, visit the company at SMTA Guadalajara 2017 for more information.
About Karl Seelig
Karl Seelig is Vice President of Technology of AIM. In his over 30 years of industry experience, he has written and presented numerous technical papers on topics including lead-free electronics assembly, no-clean flux technology, assembly & process optimization, inspection, and metallurgical studies. Mr. Seelig serves as the Chairman of the IPC Solder Products Value Council and has been involved in the development of material specifications under IPC. He has also received numerous patents in soldering technology, including four lead-free solder alloys.
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit http://www.aimsolder.com.