ADLINK and Radisys to Showcase Telecom Industry’s Open Compute Project Carrier Grade Spec Featuring First OpenSled Based on Latest Intel® Xeon® Scalable Processors

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Representing a significant step in the evolution of OCP’s CG-OpenRack-19 specification, the first hands-on demonstration of OpenRack, OpenSled infrastructure will be featured at the upcoming Broadband World Forum

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The collaboration on the OCP CG-OpenRack-19 between Radisys and ADLINK is an exciting and much anticipated milestone in the realization of a carrier-grade open architecture for the telecom market.

The telecom industry will get its first view of the Open Compute Project (OCP) carrier grade CG-OpenRack-19 specification featuring ADLINK’s OCP-ACCEPTED™ OpenSled configuration using the latest Intel® Xeon® Scalable Processors with Intel® C620 Series Chipsets, formerly codenamed Purley (Skylake-SP and Lewisburg). The CG-OpenRack-19 specification is the result of OCP’s Telecom Working Group, which develops open architecture for carrier grade, frame-level solutions. The open architecture for CG-OpenRack-19 based on the Radisys contributed OCP-ACCEPTED™ OpenRack specification and ADLINK’s OCP-ACCEPTED™ OpenSled specification will be on display in the OCP Experience Zone, Booth FA13B, Hall 22b, at the international Broadband World Forum on October 24-26 in Berlin, Germany.

The OCP-ACCEPTED™ OpenRack, OpenSled configuration marks a significant milestone in the evolution of OCP CG-OpenRack-19 as it continues the expansion of OCP-CG open architectures. The specification offers telecom data center operators the benefits of open platform standards combined with the needed carrier-grade and environmental enhancements required for Edge Computing in telecom data center environments. The open system approach drives innovation in the market and allows operators to avoid vendor lock-in that comes with propriety solutions.

“As the networking and communications market continues to transform itself into a virtualized network, including Edge Computing technologies, the need for operators to integrate multiple hardware and software assets is one of the most critical factors in NFV/SDN and Multi-access Edge Computing deployments in the next few years,” said Jeff Sharpe, director, strategic product planning at ADLINK.

“Non-proprietary open architecture enables a broad spectrum of partners and suppliers, while reducing their total cost of ownership,” said Bryan Sadowski, vice president, FlowEngine and DCEngine, Radisys. “Based on collaboration with our CSP customers and partners, OCP for carrier-grade deployments is one of the best ways to reduce costs and provide faster time-to-market. Radisys is commited to enabling open telecom solutions in this emerging ecosystem.”

ADLINK and Radisys are active members in OCP and have been instrumental in defining a technology path to an open architecture solution for the telecom industry. Radisys laid the foundation for the OCP-ACCEPTED™ CG-OpenRack-19 spec by submitting definitions for the frame, power, interconnect and sled dimensions. Its DCEngine™ is the industry’s first open hardware solution based on the specification.

The OCP-ACCEPTED™ OpenSled spec, based on ADLINK’s OCCERA (Open Compute Carrier-grade Edge Reference Architecture), enhances the original spec by providing definitions for the internal configuration options of the CG-OpenRack-19 sled, including options for key appliances to utilize additional components inside the sled.

The ADLINK sled displayed with the OCP CG-OpenRack-19 implementation at the Broadband World Forum will feature the latest Intel® Xeon® Scalable Processors with Intel® C620 Series Chipsets. The platform provides compelling benefits across a broad variety of use models, including big data, artificial intelligence, high-performance computing, enterprise-class IT, cloud, storage, communication and Internet of Things (IoT). Feature enhancements over previous versions of Intel® Xeon® Processor-based platforms include 1.5x memory bandwidth, integrated network/fabric and optional integrated accelerators.

“The collaboration on the OCP CG-OpenRack-19 between Radisys and ADLINK is an exciting and much anticipated milestone in the realization of a carrier-grade open architecture for the telecom market,” said Bill Carter, chief technology officer at the OCP Foundation. “Working closely with the service provider community, ADLINK and Radisys are delivering innovation and driving openness.”

“Our OpenSled design integrates smoothly with the OpenRack specification,” said Sharpe. “It’s designed mainly for network deployed products for telecom specific applications, for example: DPI, security, policy, media and transcoding.”

Sharpe added that ADLINK will continue its collaboration efforts, which will allow the company to provide useful specifications for full-width sleds, storage and other key technologies consistent with OCP-CG infrastructure.

To download ADLINK’s OCP-ACCEPTED™ OpenSled specification or Radisys’ CG-OpenRack-19 specification, visit here.

For more information on ADLINK’s OCCERA, visit http://www.adlinktech.com/OCCERA/.

About Radisys
Radisys, a global leader in open telecom solutions, enables service providers to drive disruption with new open architecture business models. Radisys’ innovative disaggregated and virtualized enabling technology solutions leverage open reference architectures and standards, combined with open software and hardware to power business transformation for the telecom industry, while its world-class services organization delivers systems integration expertise necessary to solve communications and content providers’ complex deployment challenges. For more information, visit http://www.Radisys.com.

About ADLINK
ADLINK Technology is leading edge computing with solutions that drive data-to-decision applications across industries. ADLINK offers a variety of building blocks and both generic and market-specific Industrial Internet of Things (IIoT) platforms to serve the automation, communications, medical, transportation, and defense/government verticals. Our products include motherboards, blades, chassis, modules, gateways, systems, and end-to-end solutions based on industry standard form factors, as well as an extensive line of test & measurement products and smart touch computers, displays, and handhelds that support the global transition to always-connected systems. Many products are Extreme Rugged, supporting extended temperature ranges, shock and vibration.

ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations and interoperability initiatives, including PCI Industrial Computer Manufacturers Group (PICMG), PXI Systems Alliance (PXISA), Standardization Group for Embedded Technologies (SGeT), European Telecommunications Standards Institute (ETSI), and Open Compute Project (OCP).

ADLINK is a global company with a local touch. Headquartered in Taiwan, ADLINK offers manufacturing in Taiwan and China; R&D and integration in the US, Germany, Taiwan and China; an extensive network of worldwide sales and support offices; and a continually expanding partner ecosystem. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).

Intel and Xeon are trademarks of Intel Corporation in the U.S. and other countries. Radisys® is a registered trademark of Radisys

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