FLORENCE, Ky. (PRWEB) November 03, 2017
Balluff is pleased to announce the release of the new Self-Adhesive Capacitive Strip Sensor. The self-adhesive sensor head is suitable for non-contact and continuous level detection of liquids or bulk materials over a wide range in non-metallic containers. This sensor head enhances Balluff's industry leading portfolio of capacitive sensors which includes level, object detection, enhanced technologies, and miniature sensors in a wide variety of housing sizes and materials.
"Flexibility is defined with the ability to cut the sensor strip to any desired length," shares Jack Moermond, Balluff Inc Capacitive Product Marketing Manager, "with a sensing range from 108mm to 850mm. In addition, the material of the strip allows the sensor to conform to container walls." The integrated adhesive surface can be easily attached to a container's surface without the use of any additional hardware. Powered by a separately available amplifier, the sensor can provide a continuous voltage analog output or a continuous current analog output or a digital value via IO-Link.
The flexibility of the sensor head, simple installation, and easy controls integration translates to cost savings for machine builders and manufacturers in a wide variety of industries from packaging to factory automation.
- Flexible by cut-to-length from 108mm to 850mm
- Externally mount to non-metallic containers
- Analog or IO-Link data connectivity
- Easy & simple installation with self-adhesion
About Balluff Inc.: Balluff Inc., the U.S. subsidiary of Balluff GmbH, Neuhausen, Germany, is a leading manufacturer of a wide range of inductive, photoelectric, vision, capacitive and magnetic sensors as well as linear position transducers, RFID systems, and networking products. Balluff products for OEM and factory floor solutions are used to control, regulate, automate, assemble, position, and monitor manufacturing, assembly, and packaging sequences for industries including: metalworking, automotive, plastics, material handling, wood processing, aerospace, alternative energy, medical, electrical, and electronics.