Ardent Concepts Releases Quick and Robust 40GHz+ IC Footprint Probing Solution

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IC Footprint Probe (ICFP) is a cost effective and time saving alternative to expensive X-Y tables and fragile planar probes

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IC Footprint Probe

“With the IC Footprint Probe, engineers have access to reference design de-bug & loss de-embedding, quick TDR measurements, and test interface characterization/troubleshooting in an easy-to-use and precise system.”

Ardent Concepts, Inc., a leading designer and manufacturer of high performance GHz connectors, sockets, and probes used in the development of next generation high speed applications has released a new product aimed at offering simple 50 ohm access to IC contact pads and signal paths on an IC circuit footprint. IC Footprint Probe (ICFP) lets engineers, who are accustomed to using costly X-Y tables and fragile planar probes, probe multiple signals at once with a simple and quick solution. With ICFP technology, test engineers and reference design engineers can implement the shortest, fastest, compression mount connector technology on the planet to probe multiple signals simultaneously.

ICFP utilizes Ardent’s patented compliant pin technology, Spring ProbeTM, where a “wipe action” of the coils causes the contact to behave like a solid element instead of behaving like an inductor. The result is exceptionally clean AC performance in an extremely short electrical path. ICFP’s interface provides Ground-Signal-Signal-Ground (G-S-S-G) contact and boasts a mechanical cycle count of 1000 mates or more, providing a technically superior improvement over traditional probing methods. This interface, combined with low-loss semi-rigid cables, high performance connectors, and an alignment plate for precise probing of multiple signals creates a simple and easy to use probing system that remarkably fits completely within the footprint of your IC.

“We felt that ICFP was a natural compliment to our high performance solderless sockets and TR MulticoaxTM products to help system designers with an entire toolkit for design and debug of their systems.” said Ardent President and Chief Technology Officer, Gordon Vinther. “With the IC Footprint Probe, engineers have access to reference design de-bug & loss de-embedding, quick TDR measurements, and test interface characterization/troubleshooting in an easy-to-use and precise system.”

About Ardent Concepts

Ardent Concepts is a leading designer and manufacturer of high performance multicoax and coaxial assemblies, probes, connectors, and sockets used in the development of next generation semiconductors and electronics systems. Our core technology is the smallest, fastest, most electrically efficient compression mount connector technology worldwide. It is used to connect: integrated circuits and printed circuit boards to instrumentation and to each other offering superior signal integrity in a high speed environment. Markets for our products include: Semiconductor, Test & Measurement, Military/Aerospace, Communications and Medical. http://www.ardentconcepts.com.

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Nat Stevens
@ArdentConcepts
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