Micross Advanced Interconnect Technology Raleigh Site Receives AS9100, Rev. D / ISO9001:2015 Quality Management Certification

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Micross announced today that it has successfully completed the transition audit to the new revision of AS9100, Rev. D / ISO9001:2015 certification at its ITAR-registered premier wafer bumping and wafer-level packaging research & fabrication facility in Raleigh, North Carolina

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Wafer Level Packaging Micross AIT

Micross announced today that it has successfully completed the transition audit to the new revision of AS9100, Rev. D / ISO9001:2015 certification at its ITAR-registered premier wafer bumping and wafer-level packaging research & fabrication facility, Micross Advanced Interconnect Technology, LLC (Micross AIT) located in Research Triangle Park, North Carolina.

Micross AIT houses an ITAR-registered, state-of-the-art microfabrication facility that allows us to provide production services, development, and custom (flexible) prototyping for our customers. We provide a wide variety of advanced interconnect technologies for realizing your next-generation electronic systems inclusive of flip-chip and wafer-level packaging, copper redistribution, Cu pillar interconnects, through silicon vias (TSVs), through-glass vias (TGV), high-density (fine-pitch) interconnects and fabrication of Si or glass interposers, as well as any combination of these technologies for commercial, private, and government customers.

"Micross AIT is extremely proud to obtain this accreditation which reflects the hard work and efforts of the AIT Team in support of its clients. For more than 25 years, Micross AIT has been at the cutting edge in the development of interconnect and packaging technologies and this certification re-confirms our commitment to delivering the highest quality standards to our customers,” stated John Lannon, General Manager of Micross AIT. “Furthermore, this provides assurance to our Aerospace & Defense customers that the processes put in place will continue to meet the rigorous quality requirements they demand,” he continued.

For additional information about Micross AIT and its capabilities, visit http://www.micross.com or contact Alan Huffman, Director of Engineering at Alan.Huffman(at)micross(dot)com

About Micross
Micross is the leading one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for more than 35 years, our comprehensive array of hi-reliability capabilities serve the global Aerospace, Defense, Space, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle.

Micross Corporate Contact:
Valerie Thomas, Director of Marketing Communications
Valerie.thomas(at)micross(dot)com

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Valerie Thomas
Micross Components
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