Dallas, Texas (PRWEB) June 23, 2014
The electronic adhesives market was estimated around $3.0 billion in 2013, with the highest share of more than 60% held by Asia-Pacific and RoW together. The global market is projected to grow at a CAGR of 10.1% from 2014 to 2019 to reach $5.5 billion by 2019. The highest investment is projected to be in the Asia-Pacific region due to the growing application markets, especially in China. The electronic adhesives market in the RoW region is estimated to witness the second highest growth at 6.80% from 2014 to 2019.
Below Companies Mention in this report:
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H.B. Fuller (U.S.) and Henkel AG & Company (Germany) are the important active players in the electronic adhesives market. These companies showed the highest strategy adoptions amongst other players in the global electronic adhesives market, accounting for over 60.0% of the total market activities from 2010 to 2014.
From 2010 to 2014, mergers & acquisitions were observed as the most important growth strategy adopted by the electronic adhesive companies, accounting for a share of 40.0%. The other companies — Alent (U.K.), Hitachi Chemicals (Japan), Dow Corning (U.S.), and Dai Nippon Printing Co. Ltd. (Japan) contributed the other 40% of the market activities in the electronic adhesives market during the period of study.
The key companies offering electronic adhesives are mainly involved in acquisitions. The companies rigorously adopt the acquisition strategy to strengthen their position in the electronic adhesives market. The acquired player is sometimes a small player in a new market or a player with high technical expertise. The large players of the market actively participated in expanding their global reach, while the small companies concentrated more on new product developments during 2010 to 2014.
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Table of Contents
1.1 Objectives of The Report
1.2 Report Description
1.4 Research Methodology
1.4.1 Market Size
1.4.2 Important Secondary Sources Used
1.4.3 Key Data Taken From Secondary Sources
1.4.4 Key Data Taken From Primary Sources
1.4.5 Assumptions Made in This Report
1.5 Key Questions Answered
2 Executive Summary
3 Premium Insights
3.1 Electronic Adhesives Market Segments
3.2 Electronic Adhesives Market Dynamics
3.3 Electronic Adhesives Market, By Property
3.4 Electronic Adhesives Market, By Form
3.5 Electronic Adhesives Market, By Application
3.6 Electronic Adhesives Market, By Geography
4 Market Overview
4.2 Value Chain Analysis
4.3 Market Dynamics
188.8.131.52 Emerging Demand in Asia-Pacific
184.108.40.206 Established Electronics Market in Developed Countries
220.127.116.11 Fluctuations in The Currency Exchange Rates of Japan
18.104.22.168 Growing Technological Dominance
4.4 Burning Issue
4.4.1 Impulsive Market Conditions & Product Costs
4.5 Winning Imperatives
4.5.1 Expansion and Acquisition of Local Businesses
4.6 Porter’s Five Forces Analysis
4.6.1 Degree of Competition
4.6.2 Threat of New Entrants
4.6.3 Threat of Substitutes
4.6.4 Supplier’s Power
4.6.5 Buyer’s Power
5 Electronic Adhesives Market, By Property
5.2 Electrically Conductive Adhesives
5.3 Thermally Conductive Adhesives
5.4 Uv Curing Adhesives
6 Electronic Adhesives Market, By Forms
6.1.1 Liquid Form
6.1.2 Paste Form
6.1.3 Solid Form
7 Electronic Adhesives Market, By Applications
7.1.1 Printed Circuit Boards (PCB)
7.1.2 Semiconductor & IC
8 Electronic Adhesives Market, By Geography
8.2.4 South Korea
8.3 North America
9 Competitive Landscape
9.2 Mergers & Acquisitions: Most Preferred Growth Strategy
9.3 Maximum Developements in 2012
9.4 Active Participants
10 Company Profiles (Overview, Financial*, Products & Services, Strategy, and Developments)
10.1 BASF SE
10.2 Dow Chemicals Co.
10.3 Henkel Ag & Company, Kgaa
10.4 Alent Plc
10.5 Hitachi Chemical Co. Ltd.
10.6 Kyocera Chemical Corporation
10.7 H.B. Fuller
10.8 The 3m Company
10.9 LG Chemical Ltd.
10.10 Indium Corporation
10.11 Mitsui Chemicals, Inc.
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