An expensive FIB instrument is no longer needed for the complicated and time consuming specimen preparation manipulation process.
Lehigh Acres, FL (PRWEB) July 29, 2014
EXpressLO LLC, expert provider of focused ion beam (FIB) ex situ lift out specimen preparation solutions, has been granted patent number 8,789,826 by the U.S. Patent and Trademark Office for specimen manipulation methods incorporating a unique specimen carrier support grid design described in U.S. Patent 8,740,209. This is the second company patent for EXpressLO LLC awarded to founder and President, Dr. Lucille A. Giannuzzi.
These complementary patents extend EXpressLO’s portfolio of intellectual property. The EXpressLO™ carrier support grid and lift out methods for manipulating and holding site specific FIB prepared specimens allow research scientists and engineers to perform characterization and analyses by electron microscopy or other analytical instrumentation. With the patented support grids and method, lift out and manipulation of specimens are performed outside the FIB on an EXpressLO™ station, reducing the capital cost of specimen preparation by more than 90 percent. In addition, the newly released Pick&Place™ holder kit incorporates a dual pin EXpressLO™ grid holder and leveling device to maximize geometries used for the patented lift out process and post lift out FIB processing. The EXpressLO™ lift out process benefits FIB users in industry and universities in both the life sciences and physical sciences.
“The unique specimen support grid design and flexible lift out methods allow for fast, easy, and reproducible FIB specimen preparation with the added benefit of post-processing capabilities,” stated Dr. Giannuzzi. “An expensive FIB instrument is no longer needed for the complicated and time consuming specimen preparation manipulation process.”
EXpressLO LLC will showcase this solution at the following upcoming conferences/exhibits: IUMAS-6 and Microscopy & Microanalysis 2014 in Hartford, CT August 2-7, 2014; the 18th International Microscopy Congress (IMC) in Prague, Czech Republic, September 7-12, 2014; and the 40th International Symposium for Testing and Failure Analysis (ISTFA) in Houston, TX, November 9-13, 2014.