Strong Demand for Electronic Systems Drives the IC Substrates Market, According to a New Trend Report Published by Global Industry Analysts, Inc.

GIA announces the release of a trend report on IC Substrates. Market for IC Substrates is projected to witness robust growth driven by strong demand for electronic systems especially mobile handsets.

  • Share on TwitterShare on FacebookShare on Google+Share on LinkedInEmail a friend
IC Substrates: A Trend Report

San Jose, California (PRWEB) January 16, 2014

Follow us on LinkedIn – IC Substrates, also referred to as IC carriers, are miniaturized circuits used as packaging for ICs, assembled into electronic devices such as digital cameras, mobile phones, engine controls, memory modules, and global positioning systems. The major usage of IC substrates in electronic devices is in circuit protection and support; power and signal distribution; as well as heat dissipation. The market for IC substrates is expected to benefit from advancements in IC substrate packaging technologies such as stacked packaging, system on package (SoP), wafer-level packaging (WLP) and SiP, among others. In line with the continuous technology innovation in the IC packaging industry to address the ever-increasing demand for superior computing power, as well as optimum line and space utilization in conductors, IC substrates are also expected to witness a parallel rise in innovation. For instance, thin halogen-free IC substrates with superior performance and reduced risk of warpage are poised to witness strong demand.

The trend report titled “IC Substrates” announced by Global Industry Analysts Inc., is a focused research paper which provides cursory insights into the product, its applications, player market share, future prospects, and corporate initiatives of key companies worldwide. The report also provides global market estimates and projections for IC Substrates in US dollars for years 2012 through 2017. Also covered are companies such as Atotech Deutschland GmbH, Camtek Ltd., Fujitsu Interconnect Technologies Ltd., Hoya Corporation, Kinsus Interconnect Technology Corporation, LG Innotek Co., Ltd., Nan Ya PCB Corporation, Samsung Electro-Mechanics Co. Ltd., Tong Hsing Electronic Industries Ltd., and Unimicron Technology Corporation, among others.

For more details about this trend report, please visit http://www.strategyr.com/TrendReport.asp?code=146299

About Global Industry Analysts, Inc.
Global Industry Analysts, Inc., (GIA) is a leading publisher of off-the-shelf market research. Founded in 1987, the company currently employs over 800 people worldwide. Annually, GIA publishes more than 1300 full-scale research reports and analyzes 40,000+ market and technology trends while monitoring more than 126,000 Companies worldwide. Serving over 9500 clients in 27 countries, GIA is recognized today, as one of the world's largest and reputed market research firms.

Global Industry Analysts, Inc.
Telephone: 408-528-9966
Fax: 408-528-9977
Email: press(at)StrategyR(dot)com
Web Site: http://www.StrategyR.com/

###


Contact