Increasing Semiconductor Manufacturing Activity Drives the Global Thin Layer Deposition Equipment Market, According to New Report by Global Industry Analysts, Inc.

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GIA announces the release of a comprehensive global report on Thin Layer Deposition Equipment. The global market for Thin Layer Deposition Equipment in semiconductor applications is projected to reach US$13.6 billion by 2020, driven by expanding electronics industry and parallel growth in demand for semiconductor solutions.

Thin Layer Deposition Equipment: A Global Strategic Business Report

Follow us on LinkedIn – Defined as the building block of miniaturization and MEMS processing, thin layer deposition is a critical part of the fabrication process and represents a key element in the production of all electronic devices.
Numerous deposition systems are used in manufacture of different categories of semiconductors in application areas such as copper interconnects /electrodes, copper barrier/seed layers beyond 70nm, Hi K dielectric gate stacks, and Gap dielectrics, among others. Healthy growth in demand for fab and wafer continues to maintain sustained growth in the semiconductors market in tandem with robust sales of consumer electronic products. Additionally, high demand for automotive electronics and industrial electronic equipment also continue to push the demand for semiconductors.

The high tempo in semiconductor market is generating persistent demands for sophisticated, high-performance packaging equipment from fab and wafer manufacturers. Advanced, feature-rich Physical Vapor Deposition (PVD), Chemical Vapor Deposition and Atomic Layer Deposition (ALD) systems are designed and developed for delivering best-in-class deposition performance, high wafer/hour production rates, and reduced wastage. High-quality ferromagnetic thin films, gallium nitride (GaN) structures, Nano-deposition and 3D modelling are some of the new generation concepts being studied in semiconductor R&D. In order to study and analyze the complex substrates as well as tool design, several semiconductor R&D labs are increasingly adopting sophisticated CVD, PVD or ECD systems thus benefit market expansion in the coming years.

As stated by the new market research report on Thin Layer Deposition Equipment, Taiwan represents the largest market worldwide. Rest of World represents the fastest growing market with a projected CAGR of 16.1% over the analysis period. Among various types of equipment, Chemical Vapor Deposition (CVD) equipment represents the largest equipment type. Atomic Layer Deposition (ALD) represents the fastest growing equipment category driven by increasing adoption in the production of advanced semiconductor solutions for use in new generation electronic gadgets such as mobile phones, smartphones, PDAs, DVD players, portable media players, video games, home-theater systems, microwaves, and printers, among others.

Key players covered in the report include AIXTRON SE, Applied Materials Inc., ASM International N.V., Canon ANELVA Corporation, CHA Industries Inc., CVD Equipment Corporation, Denton Vacuum LLC, Edwards Limited, Ionbond AG, Jusung Engineering Co. Ltd., KDF Electronic & Vacuum Services Inc., Kokusai Semiconductor Equipment Corporation, Lam Research Corporation, RIBER SA, Seki Diamond Systems, Silicon Genesis Corporation, SPTS Technologies, Taiyo Nippon Sanso Corporation, Ti-Coating Inc., Tokyo Electron Limited, ULVAC Technologies Inc., Vapor Technologies Inc. and Veeco Instruments Inc., among others.

The research report titled “Thin Layer Deposition Equipment: A Global Strategic Business Report”, announced by Global Industry Analysts, Inc., provides a comprehensive review of industry segments, trends, growth drivers, restraints, market share, market size, product launches, mergers, acquisitions and other strategic industry activities. The report provides market estimates and projections in for all major geographic markets including the US, Japan, Europe (France, Germany, Ireland, Italy, The Netherlands, and UK), China, South Korea, Taiwan, and Rest of World (UAE, Israel, Malaysia, Mexico, and Singapore). Technology segments analyzed in the report include Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD) ((Plasma CVD, Low Pressure CVD, and Other CVD)), Atomic Layer Deposition (ALD), and Epitaxy.

For more details about this comprehensive market research report, please visit -
http://www.strategyr.com/MarketResearch/Thin_Layer_Deposition_Equipment_Market_Trends.asp

About Global Industry Analysts, Inc.
Global Industry Analysts, Inc., (GIA) is a leading publisher of off-the-shelf market research. Founded in 1987, the company currently employs over 800 people worldwide. Annually, GIA publishes more than 1300 full-scale research reports and analyzes 40,000+ market and technology trends while monitoring more than 126,000 Companies worldwide. Serving over 9500 clients in 27 countries, GIA is recognized today, as one of the world's largest and reputed market research firms.

Global Industry Analysts, Inc.
Telephone: 408-528-9966
Fax: 408-528-9977
Email: press(at)StrategyR(dot)com
Web Site: http://www.StrategyR.com/

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