YES stainless steel cassettes outperform quartz cassettes because they transfer heat well and have excellent particle performance.
Livermore, CA (PRWEB) January 12, 2015
Yield Engineering Systems (YES) manufactures a wide variety of semiconductor manufacturing tools and accessories, including, stainless steel cassettes. YES cassettes range in size to accommodate wafers from 2” to 300 mm at very competitive prices. YES cassettes are:
- Semi compliant
- Withstands temperatures up to 500°C
- Excellent performance (Won’t degrade over time and do not generate particles)
- Compatible with automated and manual wafer transfer tools
- Made with 316L SST welded, electro-polished construction
- Uniform substrate temperature processing
- Chemical resistant
In addition to standard wafer sizes, custom cassettes are available upon request. YES cassettes are designed to achieve accurate wafer support with minimal mass.
“For over 30 years we have manufactured semiconductor ovens. In recent years, our product line has increased to include accessories, such as, stainless steel cassettes,” said Lori Cantrell, Vice President of Sales and Marketing, “YES stainless steel cassettes outperform quartz cassettes because they transfer heat well and have excellent particle performance. YES has branched out into different areas and we want to ensure our customers know we have several products to help solve their process needs.”
For more information regarding YES cassettes, visit http://www.yieldengineering.com or contact them toll free in the USA or Canada at 888-937-3637 or worldwide at +1-925-373-8353 ext. 210.
About Yield Engineering Systems, Inc.
YES was founded in 1980, and is headquartered in Livermore, California, USA. They provide quality process equipment for semiconductor, photovoltaic, WLP, FPD, MEMS, medical, nanotech industries and more.
In addition to cassettes they manufacture high temperature vacuum cure ovens, silane vapor phase deposition systems, plasma etch and clean tools used for precise surface modification, surface cleaning, and thin film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical slides.