Key Players in the Europe electronic packaging material market are BASF, Hitachi Chemical Co. Ltd. and Alent plc
(PRWEB) November 10, 2014
The Europe electronic packaging material market report defines and segments the concerned market in Europe with analysis and forecast of revenue. This market is estimated to grow to $3,039.1 million by 2019 at a CAGR of 3.0% from 2014 to 2019.
Browse through the TOC of the European Electronic Packaging Material Market report to get an idea of the in-depth analysis provided. It also provides a glimpse of the segmentation in the market, and is supported by various tables and figures.
Electronic packaging refers to the method of enclosing, protecting, or providing physical structure to either electronic components, assemblies of components, or finished electronic devices. Electronic packaging materials are used to provide protection against corrosion and external impact; they also hold contact pins or leads used to connect from external circuits to semiconductor and IC devices. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission, protection from electrostatic discharge, maintenance, operator convenience, and cost. Semiconductor and integrated circuit (IC) packaging materials play an important role in the electronic packaging materials industry as these enhance the safety and protection of electronic components.
The European region has huge potential as a market for electronic packaging material, and its demand in the in electronics sector is driven mainly by upcoming technologies in the market. Consumer spending is driving the electronics market in the region, where the demand for electronic products with better performance and high speed is rising. Product look and feel, functionality, time to market, and cost are becoming critical factors, and packaging plays a major role in delivering solutions to meet these needs. Germany is the largest market for the production and consumption of electronic packaging materials in the region.
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This report covers the European electronic packaging material market, which has been segmented on the basis of type, application, technology, and ingredients. Major applications include dual flat no lead package, dual in-line package, grid array, quad flat no-leads package, quad flat package, and small outline package. The countries included in the European electronic packaging materials market report are Germany, U.K., Italy, and France.
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This report includes market shares and value chain analyses, along with market metrics such as drivers and restraints. In addition, it presents a competitive landscape and company profiles of the key players in this market.
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North America Electronic Packaging Material Market
Semiconductor and IC packaging materials play an important role in the electronic packaging materials industry as these enhance the safety and protection of electronic components. The North America Electronic Packaging Material Market was valued at $2,935.86 million in 2013 and is expected to reach $3,367.02 million in 2019 with a growing CAGR of 3.2% from 2014. The demand for packaging materials is primarily driven by the demand in end-user industries and increased demand for mobile and computing applications.
Electronic packaging materials are used to provide protection against corrosion, external impact and also hold the contact pins or leads used to connect from external circuits to the device of semiconductors and ICs.
The North American semiconductor & IC packaging materials market has been witnessing a steady growth, as the nation maintains its position as a leader in cutting-edge development of fabrication of semiconductors. With one of the highest consumption of consumer electronics across the globe, the U.S. market has huge demand and production capacity for electronic packaging materials. However, with the recent shift towards low-cost Asian countries, the U.S. market is gradually losing its dominance
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