Key Players in the North America electronic packaging material market are BASF, Hitachi Chemical Co. Ltd. and Alent plc
(PRWEB) November 10, 2014
The North America electronic packaging material market report defines and segments the concerned market in North America with analysis and forecast of revenue. This market is estimated to grow to $3,301.0 million by 2019 at a CAGR of 3.2% from 2014 to 2019.
Browse through the TOC of the North American Electronic Packaging Material Market report to get an idea of the in-depth analysis provided. It also provides a glimpse of the segmentation in the market, and is supported by various tables and figures.
Electronic packaging refers to the method of enclosing, protecting, or providing physical structure to either electronic components, assemblies of components, or finished electronic devices. Electronic packaging materials are used to provide protection against corrosion and external impact; they also hold contact pins or leads used to connect from external circuits to semiconductor and IC devices. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission, protection from electrostatic discharge, maintenance, operator convenience, and cost. Semiconductor and integrated circuit (IC) packaging materials play an important role in the electronic packaging materials industry as these enhance the safety and protection of electronic components.
In the North American region, the demand for electronic packaging material has been driven by the trend of miniaturization of ICs, smaller form factors, cost and performance, and the extension of Moore's Law, which dictates that miniaturization or device scaling will lead to more performance at an overall lower cost. North America, particularly the U.S., is known for its quick technological advancements. In the past fifteen years, communication and information technology and the internet have changed the paradigm and brought the world closer together, launching the age of advanced communication and information. Novel technologies have enabled faster access to information and easy communication, collaboration, and connectivity. Therefore, with devices becoming smaller and quick up gradation of technologies, the demand for electronic devices will remain high and their packaging requirements will evolve continuously. This will continue to drive the demand for electronic packaging materials in the region.
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This report covers the North American electronic packaging material market, which has been segmented on the basis of type, application, technology, and ingredients. Major applications include dual flat no lead package, dual in-line package, grid array, quad flat no-leads package, quad flat package, and small outline package.
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This report includes market shares and value chain analyses, along with market metrics such as drivers and restraints. In addition, it presents a competitive landscape and company profiles of the key players in this market.
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Asia-Pacific Electronic Packaging Material Market
Semiconductor and IC packaging Material play an important role in the electronic packaging Material industry as these enhance the safety and protection of electronic components. The Asia-Pacific Electronic Packaging Material Market was valued at $14,896.9 million in 2013 and is expected to reach $18,839.5 million in 2019 with a growing CAGR of 5.1% from 2014. The demand for packaging Material is primarily driven by the demand in end-user industries and increased demand for mobile and computing applications.
Electronic packaging Material are used to provide protection against corrosion, external impact and also hold the contact pins or leads used to connect from external circuits to the device of semiconductors and ICs.
Asia-Pacific holds the largest market for semiconductor and IC packaging Material and expected to see further growth with technological innovations and the need for smaller packaging Material, especially for the applications related to consumer Electronic.
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