Livermore, CA (PRWEB) September 04, 2013
Yield Engineering Systems, Inc. (YES), a quality process equipment manufacturer, announced today that they will be exhibiting at The 10th Annual International Wafer Level Packaging Conference (IWLPC) being held at the Doubletree by Hilton Hotel in San Jose on November 6-7, 2013. YES will be located at Booth #6. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
YES manufactures a wide variety of processing equipment including high reliability tools for Wafer Level Packaging (WLP) type processes and Redistribution Layers (RDL) with a low-cost of ownership. The YES-VertaCure and the YES-450-PB Series use a high temperature, vacuum cure process to achieve metal annealing, wafer dehydration and getter activation.
The most significant benefits in vacuum curing is the quality of the cured film allowing precise control over cracks, surface roughness and thickness uniformity. While the high temperature attains complete imidization and optimizes electrical and mechanical properties in substrates.
“The IWLPC Conference is a great fit for Yield Engineering Systems and it is important for us to exhibit at this show,” said Bill Moffat, Founder and CEO of YES. “The WLP industry is developing rapidly and YES has positioned itself to be a part of that growth.”
For more information regarding the YES tools, visit http://www.yieldengineering.com or contact them toll free in the USA or Canada at 888-937-3637 or worldwide at +1-925-373-8353.
About Yield Engineering Systems, Inc.
YES was founded in 1980, and is headquartered in Livermore, California, USA. They provide quality process equipment for semiconductor, photovoltaic, WLP, FPD, MEMS, medical, nanotech industries and more.
They manufacture high temperature vacuum cure ovens, chemical vapor deposition (CVD) systems, plasma etch and clean tools used for precise surface modification, surface cleaning, and thin film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical slides.