Surface mounted capacitor is updated during the FDTD simulation based on its SPICE model.
Circuit co-simulation facilitates a more realistic analysis of device performance by including imported circuit components within the electromagnetic simulation.
STATE COLLEGE, Pa. (PRWEB) December 13, 2017
Remcom announces circuit co-simulation and expanded signal integrity capabilities in the latest update to XFdtd® 3D Electromagnetic Simulation Software.
Circuit co-simulation facilitates a more realistic analysis of device performance by including imported circuit components within the electromagnetic simulation. The schematic for a desired component may be imported into XF via a netlist file, with support for SPICE elements such as resistors, capacitors, inductors, coupled inductors, and subcircuits. Netlist components can also be assigned as a matching circuit embedded within a feed, simplifying matching network design.
This release also introduces a nodal waveguide interface with enhanced options for computing S-parameters. A user-defined reference impedance enables renormalized S-parameters to be computed for transmission lines that would typically display an impedance mismatch. A nodal excitation is also available for simulations that do not require S-parameters to be collected.
To learn more about the updates in XF, please visit Remcom’s website.
XF users without an active Remcom Professional Support contract can upgrade to the latest version of Release 7 by contacting sales(at)remcom(dot)com.
About Remcom: Remcom provides innovative electromagnetic simulation software and wireless propagation software for commercial users and U.S. government sponsors. Remcom’s products are designed to work together to provide complete and accurate results when modeling propagation with real world devices in real world scenarios. Remcom is committed to its customers’ unique needs, offering flexible licensing options for installations of all sizes as well as custom engineered solutions.