ADLINK and our OCP partners are meeting this need by delivering next generation equipment needed to meet the rigorous OCP-ACCEPTED standards.
SAN JOSE, Calif. (PRWEB) May 11, 2018
ADLINK, a leading provider of telecom equipment and Plantinum member of the Open Compute Project (OCP), will be featuring carrier grade CG-OpenRack-19 solutions at the Big Communication Event in Booth B419 on May 14-16 in Austin, TX. These solutions include Multi-access Edge Compute solutions from multiple OCP partners and suppliers.
The Big Communications Event (BCE) is the communication industry's meeting point to discuss the major changes affecting its future. BCE brings telecom experts from around the globe. The conference and expo covers the industry's most pressing topics including automation, edge computing, intent-based networking, artificial intelligence, cloud-native software, advanced security strategies and 5G networks.
ADLINK and its partners have developed networking and communications platforms that enable Multi-access Edge Computing and cloud architectures for telecom operators and data centers. ADLINK’s Open Compute Carrier-grade Edge Reference Architecture (OCCERA) and OCP Solutions address the requirements for low-latency, high-bandwidth and compute-intensive applications driven by the needs of security, deep packet inspection (DPI), edge computing, virtual network functions, 5G evolution and other revenue producing solutions for operators.
At BCE, ADLINK, and partners nVent and Radisys will jointly showcase OCP-ACCEPTED™ OpenRack and OpenSled configurations that enable openstack resources to easily power virtualized applications at the edge. These specifications offer telecom data center operators the benefits of open platform standards combined with the required carrier-grade and environmental enhancements for edge computing in telecom data center environments. The open system approach drives innovation in the market and allows operators to avoid vendor lock-in that comes with propriety solutions. In addition, the multi-vendor solution offers seamless support across sales and integration cycles.
“Telecom operators are increasingly looking for improved technologies that ease implementaton and lower costs for Edge and 5G-based solutions. ADLINK and our OCP partners are meeting this need by delivering next generation equipment needed to meet the rigorous OCP-ACCEPTED standards.” Says Jeff Sharpe, ADLINK Director of Product Strategy for Networking and Communications. “We have been working with the OCP committee since 2012 and are very excited to see carriers deploying new equipment based on the standards. The migration to standards based equipment is allowing carriers to increase their network reliability with vendor-agnostic equipment while simultaneously lowering their costs”. Sharpe will also be participating in a panel discussion on May 16 entitled “Converting Central Offices to Datacenters” which will address the major challenges and key benefits for this industry wide initiative.
For more information on ADLINK’s OCP-ACCEPTED OCCERA platform, please visit our website.
For more information on nVent Electric’s CG-Openrack-19 capability, please visit their website.
ADLINK Technology is a global leader of Edge Computing with a mission to reduce the complexity of building IIoT systems. Through a full range of offerings including embedded building blocks, intelligent computing platforms, fully featured edge platforms, data connectivity and extraction devices, secure software for data movement and micro services, ADLINK provides complete IIoT solutions serving a large customer base across industrial automation, networking & communications, healthcare, infotainment & retail, transportation, and government & defense industries.
ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and Intel® Network Builders, has a strategic partnership with NVIDIA to bring AI to the Edge, and is active in several standards organizations and interoperability initiatives, including PCI Industrial Computer Manufacturers Group (PICMG), Standardization Group for Embedded Technologies (SGeT), Open Fog Consortium, European Telecommunications Standards Institute (ETSI), Open Compute Project (OCP), Eclipse IoT, and ROS-Industrial Consortium for robotics.
ADLINK products are available in over 40 countries across five continents with a worldwide distribution network. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).
ABOUT NVENT Electric
nVent Electric plc, (“nVent”) with a principal office in London, England, and U.S. management office in Minneapolis, Minn., is a global leader of inventive electrical solutions that connect and protect customers by creating safer systems to ensure a more secure world. The nearly 9,000 employees worldwide design, manufacture and distribute electrical enclosures, electric heat tracing solutions, complete heat management systems, and electrical and fastening solutions. In 2018, nVent became an independent, publicly traded company (NYSE: NVT) after separating from Pentair plc (“Pentair”). Its robust portfolio of leading electrical product brands dates back more than 100 years and includes nVent CADDY, ERICO, HOFFMAN, RAYCHEM, SCHROFF and TRACER.
Radisys (NASDAQ: RSYS), a global leader in open telecom solutions, enables service providers to drive disruption with new open architecture business models. Radisys’ innovative disaggregated and virtualized enabling technology solutions leverage open reference architectures and standards, combined with open software and hardware to power business transformation for the telecom industry, while its world-class services organization delivers systems integration expertise necessary to solve communications and content providers’ complex deployment challenges. For more information, visit http://www.Radisys.com.
Intel and Xeon are trademarks of Intel Corporation in the U.S. and other countries. Radisys® is a registered trademark of Radisys