CoolIT has experienced tremendous growth in data center business which we attribute to our collaborative approach to design and ability to scale manufacturing of robust and high performing Direct Liquid Cooling solutions
CALGARY, Alta. (PRWEB) June 25, 2018
CoolIT Systems (CoolIT), the global leader in energy efficient liquid cooling solutions, today announced ongoing collaborations with several Original Equipment Manufacturer (OEM) partners.
Combined with the broadest range of Coolant Distribution Units, CoolIT and their OEM partners are delivering the most reliable and adaptable liquid cooling solutions to the HPC market. Leveraging patented Split-Flow passive coldplate design, industrial grade, no-compromise components and superior centralized pumping architecture, CoolIT’s Rack DCLC™ technology has become the world leading choice for OEMs and System Integrators.
“CoolIT has experienced tremendous growth in data center business which we attribute to our collaborative approach to design and ability to scale manufacturing of robust and high performing Direct Liquid Cooling solutions,” said Patrick McGinn, VP Product Marketing & Business Development at CoolIT Systems. “CoolIT’s partners leverage our deep and focused expertise in liquid cooling technologies to drive additional value for their customers”.
COOLIT'S LARGEST OEM DEPLOYMENT TO DATE
CoolIT continues to supply its largest data center solution to date (shipments averaging 2000-4000 coldplates per month) for an undisclosed U.S. customer, supplied through an OEM partner. The complete data center installation requires over 30,000 CoolIT Systems Rack DCLC™ passive coldplates with supporting manifolds, providing Direct Liquid Cooling to Intel® Xeon Phi™ Processors and other server components.
READILY AVAILABLE SERVERS WITH INTEGRATED LIQUID COOLING
CoolIT continues to be the leading choice for Tier 1 server manufacturers and is proud to provide our partners with off-the-shelf and bespoke Direct Liquid Cooling solutions. Readily available liquid-enabled servers include:
- Intel Compute Module HNS2600BPB (Buchanan Pass)
This compact design manages 85% of the total heat load produced by the dual Intel Xeon Scalable Processors (Skylake), Voltage Regulators and memory with CoolIT’s integrated Rack DCLC Passive Coldplate Loop, providing customers with an extremely dense, energy efficient and easily serviceable data center solution.
With factory-installed and warranty supported liquid cooling, PowerEdge C6420 is purpose built for high performance, hyperscale workloads. Featuring four nodes in a 2U form factor, this robust server leverages CoolIT’s Rack DCLC RX1 Passive Coldplate to support Intel Scalable Processors (Skylake) for increased performance, energy efficiency and extremely high-level rack density. PowerEdge C6420 pairs with CoolIT’s stainless steel Rack Manifolds and Coolant Distributions Units.
The custom built Passive Coldplate Loop, which is integrated into each of the four HPE Pro-Liant XL170r Servers within the HPE Apollo 2000 System, employs CoolIT’s R4 coldplate and patented Split-Flow design to significantly enhance overall performance and efficiency.
COOLIT SYSTEMS' RACK DCLC™ RD1 PASSIVE COLDPLATE FOR AMD EPYC™ PROCESSORS
Engineered specifically for AMD EPYC™ Processors, CoolIT’s Rack DCLC RD1 Passive Coldplate enables the highest wattage CPUs. Leveraging CoolIT’s patented Split-Flow design theory and centralized pumping architecture, this passive coldplate solution eliminates the need for remote heatsinks, maximizing density in 1U applications.
EXCLUSIVE CDU DISTRIBUTION PARTNERSHIP WITH UNDISCLOSED OEM
CoolIT has been selected by an undisclosed OEM partner to supply Rack DCLC CHx80 CDU’s as part of this customers new publicly available liquid cooled product offering. CoolIT will begin shipping to this customer next month and expects the program to extend into 2020.
ABOUT COOLIT SYSTEMS
CoolIT Systems, Inc. is the world leader in energy efficient Direct Contact Liquid Cooling for the Data Center, Server and Desktop markets. CoolIT's Rack DCLC™ platform is a modular, rack-based, advanced cooling solution that allows for dramatic increases in rack densities, component performance, and power efficiencies. The technology can be deployed with any server and in any rack making it a truly flexible solution.
View original announcement here