The 3D IC LinkedIn Group has provided a great neutral forum for discussion of the challenges and breakthroughs in 2.5D and 3D IC technologies
San Jose, CA (PRWEB) July 22, 2013
The 3D-IC LinkedIn Group announced today that it reached more than 2,000 members. Started as a discussion forum for 3D Integrated Circuits (3D-ICs) in July of 2011, the LinkedIn Group has seen a rapid growth of membership due to the industry’s high level of interest in the technology.
At present, the 3D-IC LinkedIn group’s membership includes over 720 executives, 260 engineers and 570 mid-level managers. The presence of key engineers, researchers and decision makers in the 3D chip space makes the group a good forum for knowledgeable and influential discussions. Members are encouraged to initiate topics and participate in the group’s discussions. The group is run by a team of volunteers working on 3D-ICs, with support by MonolithIC 3D Inc. Its goal is to help popularize the technology and build awareness for the various 3D-IC alternatives as they continually evolve.
"The 3D IC LinkedIn Group has provided a great neutral forum for discussion of the challenges and breakthroughs in 2.5D and 3D IC technologies. It's also been a valuable resource for me, as a way of extending the reach of 3D InCites. I'm pleased to see that its numbers have reached 2000 members, and will continue to participate regularly on the group", said Francoise von Trapp, Editorial Director of 3D InCites.
Group members are highly active in discussion and comments which reveals the importance of 3D IC at this time in the industry. The group is updated daily by new discussion and comments from industry experts. It is a good way of keeping up-to-date with the latest news in the field.
“3DIC is the future of the semiconductor industry” says Brian Cronquist, VP Technology and IP MonolithIC 3D Inc. “As an industry we need to continue to achieve higher levels of integration and lower costs. The 3D IC Linked In Group is a great way to keep abreast of the fast moving changes in this critical space, and not get caught ‘missing the boat’.”
Interest in the 3D integration field has seen an exponential growth since Moore’s Law hit the ‘big bump’ at 14nm. “2.5D, 3DIC and TSV Interconnect Patent Investigation” 2013 report from Yole Development states that about 260 players are involved in 3D IC technology with 10 major companies that dominate the landscape, each with an impressive IP portfolio on three dimensional integrated circuits.
The 3D-IC LinkedIn Group is collaborating with 3D-ICs.com, a portal dedicated to aggregating news stories on the technology. The former Editorial Director of the website, Francoise von Trapp helped to establish the forum and she has been an active member. Top news articles and blog posts from 3D-ICs.com are provided on the 3D-IC LinkedIn Group for discussion and comment.
The success story of the 3D-IC LinkedIn Group motivated its creators to develop a new subgroup entitled “3D-EDA”. This subgroup was established on June 9th, 2013 and it already has more than 150 members with 27% being executives.
You can join the 3D-IC LinkedIn Group by clicking here.