CRANSTON, USA (PRWEB) October 09, 2018
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation at the SMT – Info International Conference scheduled to take place on October 16th – October 17th, 2018 in Brno, Czech Republic.
Ales Sedlak, Technical Applications Manager, will present the paper “A Practical Guide to Optimizing Solder Paste Performance for Ultra-fine Feature Printing.” This paper provides a detailed explanation of how to optimize solder paste performance from receiving to reflow. Discussion topics include paste handling, stencil design, printer set up and common defects. The presentation incorporates theory with best practice to inform the process engineer of the how, what and why of solder paste use.
AIM will also highlight its full line of advanced solder materials, including its high reliability alloys, solder paste, liquid flux and solder alloys. To discover all of AIM’s products and services, visit the company at SMT Brno or on their website http://www.aimsolder.com.
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit http://www.aimsolder.com.
October 10-12, 2018 – Productronica South China – Shenzen, Germany
October 16-17, 2018 - SMTA International – Rosemont, IL