CHANGXING, China (PRWEB) August 18, 2020
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Flopy Feng will present at the 2020 SMTA China South Technology Conference at the Shenzhen Convention & Exhibition Center in Shenzen, China. Flopy’s presentation, “Pin-In-Paste,” is scheduled for August 26th, 2020 from 11:05-11:40.
The presentation will detail the Pin-in-Paste (PiP) process including PCB and stencil design considerations as well as solder paste selection and reflow guidelines. The PiP technique can be more cost effective by eliminating the need for a wave or selective soldering process and the associated costs. Learn more on http://www.aimsolder.com.
About the Presenter
Flopy Feng is a Technical Support Manager for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over 15 years’ of experience in the SMT industry, Flopy supports AIM customers in south China.
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit http://www.aimsolder.com.