CRANSTON, R.I. (PRWEB) August 16, 2018
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the SMTA China South Technology Conference on August 27-30, 2018. Flopy Feng, Technical Support Engineer, will present on August 29, 2017 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.
Flopy’s presentation, scheduled for Wednesday, August 29, 2018, will highlight the effectiveness of I/O stencil aperture modifications on BTC void reduction. Many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. Flopy’s presentation will highlight a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
Flopy Feng is a Technical Support Engineer for AIM Solder. Having worked as a process supervisor for seven years, he is experienced in process evaluation and optimization. With over fourteen years’ experience in the SMT industry, Flopy supports AIM customers in south China.
To discover all of AIM’s products and services, visit the company at the SMTA China South Expo & Tech Forum or on their website at http://www.aimsolder.com
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit http://www.aimsolder.com.
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