Gallop Innotek will showcase its latest thermal management innovations at Thermal Management Expo Europe 2026, taking place November 10–12 at Messe Stuttgart, Germany. At Booth #936, the company will introduce four advanced solutions: a 20W high-performance thermal gap pad, a 20W non-silicone thermal pad, a MEMS air pump cooling solution, and an 18W thermal gel. These innovations address growing heat dissipation challenges in compact, high-power electronic devices, offering improved thermal efficiency, reliability, and application flexibility.
SHENZHEN, China, Oct. 29, 2026 /PRNewswire-PRWeb/ -- Gallop Innotek to Exhibit Next-Gen Thermal Management and Micro-cooling Innovations at Thermal Management Expo 2026
GALLOP INNOTEK, a leading manufacturer of high-performance thermal interface materials (TIMs), today announced its participation in the upcoming Thermal Management Expo Europe 2026. This year's event will take place from November 10th to 12th, 2026, at Messe Stuttgart, Germany.
During the exhibition, Gallop Innotek will showcase its next-generation thermal interface materials at Booth #936.
At this year's exhibition, Gallop Innotek will officially launch four breakthroughs in thermal management technology:
- 20W high-performance thermal gap pad: Engineered with ultra-low bulk thermal resistance to deliver optimal heat transfer under minimal compression forces across irregular surfaces.
- 20W non-silicone thermal pad: Formulated to eliminate volatile siloxane outgassing, making it ideal for sensitive optical modules, high-voltage automotive electronics, and relay switches susceptible to contact contamination.
- MEMS air pump innovative cooling solution: A micro-electromechanical active cooling architecture designed for targeted dynamic forced-air heat dissipation in ultra-compact mobile, medical, and handheld hardware.
- 18W thermal gel: A high-flow, non-curing gap filler formulated to provide long-term pump-out resistance and low thermal impedance in automated assembly lines.
"Modern electronic systems operate under stringent spatial limits and can attain unprecedented power densities, which calls for innovative thermal management technologies to guarantee reliability," said Oliver C., Product Manager at Gallop Innotek. "Participating in Thermal Management Expo creates a unified platform that allows us to engage directly with other industry leaders, while also providing a better way to address critical thermal bottlenecks."
To support this initiative, Gallop Innotek is providing a complimentary VIP pass code: TEEVIP28. Registration is currently ongoing through the official website: thermalmanagementexpo-europe.com.
About Thermal Management Expo
Thermal Management Expo Europe is a leading exhibition and conference that brings together key players in thermal management systems, materials, and technologies. During the event, the exhibitors showcase innovations in heat dissipation, thermal materials, cooling, and systems design.
About GALLOP INNOTEK
Gallop Innotek is a technology-driven manufacturer of advanced thermal interface materials and micro-cooling systems. The company provides a wide range of TIMs, including low-thermal resistance gap pads, non-silicone substrates, thermal gels, and custom MEMS cooling architectures.
Media Contacts:
+86 – 755 – 23765952
Media Contact
Sun Lei, Shenzhen Chidachuang Technology Co., Ltd., 86 18948796702, [email protected], https://gallopinnotek.com/
SOURCE Gallop Innotek
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