High Density Packaging (HDP) User Group is pleased to announce that Advanced Micro Devices, Inc (AMD) has become a member.
AUSTIN, Texas, Aug. 29, 2022 /PRNewswire-PRWeb/ -- High Density Packaging (HDP) User Group is pleased to announce that Advanced Micro Devices, Inc (AMD) has become a member.
"AMD thrives on an innovation-driven culture; my team evaluates PCB(A) related processes & components required to bring next generation products to market. We look forward to collaborating with HDP member OEMs, CMs, test service providers, and component/material suppliers to leverage our combined expertise in solving complex industry PCB(A) technology challenges", said Jim Merkelbach, Senior Manager – Global PCBCAD, Data Center Engineering at AMD.
"I am pleased to welcome AMD to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in high performance semiconductors, especially those focused on next-generation servers and cloud computing, will contribute significantly to several of our emerging technology projects", said Larry Marcanti, Executive Director of HDP User Group.
Founded in 1969 as a Silicon Valley start-up, the AMD has grown into a global company setting the standard for modern computing through major technological achievements. Today, AMD offers the industry's broadest portfolio of leading high-performance and adaptive processor technologies, combining CPUs, GPUs, FPGAs, Adaptive SoCs, and deep software expertise to enable leadership in computing platforms for cloud, edge and end devices.
Visit AMD at https://www.amd.com/en
HDP User Group (http://www.hdpug.org), a global research and development organization based in Round Rock, Texas, is dedicated to reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly. This international industry-led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Singapore and Tokyo.
Madan Jagernauth, High Density Packaging User Group, 1 561-501-1567, [email protected]
SOURCE High Density Packaging User Group