International Symposium for Testing and Failure Analysis Conference Proceedings Added to ASM Digital Library

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25 years of papers from the premier event for microelectronics failure analysis now available in ASM International’s Digital Library platform.

“The launch of ISTFA Proceedings enables convenient access to this valuable content to the EDFAS membership and the broader electronic device community,” said Dr. James J. Demarest, EDFAS President.

MATERIALS PARK, Ohio (December 10, 2020) – The Electronic Device Failure Analysis Society (EDFAS), an affiliate society of ASM International, is proud to announce the launch of the new ISTFA Proceedings site in the ASM Digital Library. The new site provides convenient access to conference papers from the renowned International Symposium for Testing and Failure Analysis annual event.

The transition of ISTFA Proceedings to the ASM Digital Library will bring more than 2,000 articles and case histories on all aspects of microelectronic device characterization and failure analysis published since 1996 to a content delivery platform offering “best of breed” search, browse, filtering, linking, and content access. The ISTFA content is the first set of proceedings added to the ASM Digital Library. Proceedings papers from additional ASM conference series will be added in 2021.

The ISTFA conference is the premier forum for information on all aspects of microelectronic device failure analysis. Topics covered in-depth in the collected proceedings include….

  • 3D Devices and Packages
  • System Level Analysis
  • Counterfeit Microelectronics
  • Advanced Methods and Techniques
  • Failure Analysis Process
  • Fault Isolation and Defect Localization
  • Focused Ion Beam Analysis and Circuit Edit
  • Focused Ion Beam Sample Preparation
  • Hardware Attacks and Reverse Engineering
  • Low Power Devices
  • Microscopy
  • Mixed Mode and High Power Devices
  • Nanoprobing and Electrical Characterization
  • Packaging and Assembly Analysis
  • Product Yield, Test, and Diagnostics
  • Sample Preparation and Deprocessing
  • Scanning Probe Analysis
  • Silicon Photonic Devices

The symposium has consistently provided attendees with the latest analysis techniques necessary to obtain accurate and timely information on device-related issues. The collected proceedings papers now available in the ASM Digital Library serve as a comprehensive reference of the state-of-the-art research, development, tools, and techniques as presented at ISTFA conferences over the most recent quarter decade.

“The launch of ISTFA Proceedings enables convenient access to this valuable content to the EDFAS membership and the broader electronic device community,” said Dr. James J. Demarest, EDFAS President. “We are very pleased that the ISTFA content was selected by ASM as the first set of conference content to be added to the ASM Digital Library. Enhancing the ability of ISTFA content to be discovered, accessed, and cited has been a significant goal of EDFAS.”

The ISTFA Proceedings site joins ASM Handbooks Online, ASM Technical Books, the ASM Failure Analysis Database, and Alloy Digest in the interactive ASM Digital Library platform. Additional resources are scheduled to be added to the platform in 2021.

Full access to ISTFA Proceedings is provided as a benefit of membership in the Electronic Device Failure Analysis Society. Multiuser site licenses for companies and institutions are available. For information on subscription access to ISTFA Proceedings, contact the ASM Online Database Manager at onlinedbsales@asminternational.org.

About ISTFA and EDFAS
The International Symposium for Testing and Failure Analysis (ISTFA) is the premier event for scientists and engineers who work to evaluate failures and improve the performance and reliability of semiconductor devices and processing techniques. The ISTFA conference traces its origins to the 1970s. The conference was acquired by ASM International in 1986 and has been sponsored by ASM ever since.

In 1998, the ISTFA Steering Committee proposed, and the ASM Board approved, the formation of a new ASM affiliate society, the Electronic Device Failure Analysis Society (EDFAS). While EDFAS now offers a full complement of content, networking, and education offerings, the ISTFA event remains its cornerstone offering.

About ASM International
ASM International is the world’s largest and foremost professional technical society serving the information needs of scientists, engineers, and technicians who develop, test, select, and apply advanced materials, including metals, composites, polymers, and ceramics. As the world’s largest and most established materials information society, ASM engages and connects members to a global network of peers and provides access to trusted materials information through reference content and data, education courses, international events, and applied research.

To learn more about ASM International, visit asminternational.org or call 440.338.5151 to speak with an ASM International representative. Follow us on Facebook, LinkedIn, and Twitter.

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