FLORENCE, Ky. (PRWEB) July 17, 2020
Balluff designed its new block-style capacitive smart level sensor with IO-Link for applications with highly conductive fluids like acids and bases, using smart level 50 technology to compensate for foam and deposit build up. And thanks to its IO-Link interface, it delivers expanded application and setting options.
IO-Link’s automatic parameter setting allow the user to see the upper and lower hysteresis values allowing easy and precise adjustments that aren’t possible with a potentiometer. Once unplugged, the sensor goes into standard I/O mode (SIO).
“This IO-Link version is a good addition to an already great portfolio of sensors,” said Jack Moermond, engineering partner manager with Balluff. “The addition of IO-Link provides more flexibility and more control. It is great for those who are using IO-Link in their applications, but it also can be preset with IO-Link and then used in standard mode.”
This capacitive sensor reliably detects fluid levels through non-metallic containers up to 10 mm thick, making it well suited for a wide variety of industries including packaging, food and beverage, metalworking and general factory automation.
- Detects levels through walls of non-metallic containers up to 10 mm thick
- For highly conductive media such as acids and bases
- Compensates for foam and residues using smart level 50 technology
- Operating modes: standard I/O mode (SIO), IO-Link mode
Learn more at: http://www.balluff.com
About Balluff Inc.
Balluff Inc. is the U.S. subsidiary of Balluff GmbH, Neuhausen, Germany. Balluff is a leading supplier of networked IO-Link control system architectures that unlock the potential of the IIoT and Industry 4.0. Balluff offers a wide range of intelligent IO-Link and industrial Ethernet sensors in a variety of technologies including inductive, photoelectric, capacitive, and magnetic as well as magnetostrictive linear position sensors, magnetic tape linear encoders, industrial RFID systems, and industrial vision systems. Balluff provides cost-saving, process-enhancing solutions to machine builders and manufacturers to control, regulate, automate, assemble, position, and monitor manufacturing, assembly, and packaging sequences. Industries served include: automotive, packaging, food processing, beverages, tire, primary metals, conventional and alternative energy, semiconductor, plastics, and fluid power.