SEATTLE (PRWEB) September 24, 2020
KitoTech Medical, a Seattle-based medical device company, announced today that the US Patent and Trademark Office (USPTO) has issued US Patent No. 10,751,050 entitled “MICROSTRUCTURE-BASED WOUND CLOSURE DEVICES”. The patent is directed at microMend’s wound closure products, which use KitoTech’s proprietary Microstaple technology. The company has a worldwide exclusive license for this patent from the University of Washington, where the technology was initially developed. KitoTech also has an issued patent in Europe on its microMend products.
“The granting of this US patent is an important milestone for KitoTech. It provides support for the innovations, which were originally invented at the University of Washington and led to our new approach to close wounds, including lacerations and surgical incisions. The issued patent provides the foundation for our intellectual property strategy, which includes a number of additional filed patent applications on microMend and the Microstaple technology,” says Dr. Ronald Berenson, President and CEO of KitoTech Medical.
About microMend®
microMend consists of an array of miniature stainless steel staples (Microstaples) attached to an adhesive backing that combines the holding strength of a suture with the simplicity of applying a bandage. It is designed to provide medical personnel with a cost-effective, time saving and easy-to-use option for closing lacerations, skin tears, surgical incisions, and other wounds. microMend’s consumer products make it possible for people to close lacerations at home, in the outdoors or elsewhere without the inconvenience and costs associated with ER and Urgent Care Clinic visits.
About KitoTech Medical
KitoTech Medical is a medical device company spun out of the University of Washington that is using its patented Microstaples Technology platform to develop and commercialize products for wound closure and wound care. Additional product and company information can be found online at http://www.micromendskinclosure.com.
