Micross Announces Key Hires in Engineering and Quality
ORLANDO, Fla. (PRWEB) August 27, 2018 -- Micross is pleased to announce two key additions to its ITAR-registered facility, Micross Component Modification Services (CMS) located in Hatfield, Pennsylvania. Kevin McKenna joins as Engineering Manager and Sharon Feiller is hired as Quality Manager.
Kevin comes to Micross with 35+ years of process & test engineering, manufacturing and operations experience at both large & mid-size companies including AccuSpec, Creston Electronics, ITT Space Systems and Northrop Grumman Corporation. Most recently, Kevin has been at i3 Electronics EMS where he was responsible for deployment of a new electronics manufacturing facility; he also led process & test engineering functions and managed a team of 75 direct manufacturing employees and 8 manufacturing/test engineers. Kevin holds a Bachelor’s Degree, Mechanical Engineering with a minor in Manufacturing from NY Institute of Technology.
Sharon brings 23+ years of experience in various manufacturing and quality roles within the semiconductor & energy businesses including Harris Semiconductor, Fairchild Semiconductor, ExxonMobil and International Battery. Her latest role has been in customer quality engineering with Texas Instruments where she regularly interfaced with customers to resolve product & quality concerns as well as assisted with process improvement for backend processes. Sharon holds a Bachelor of Science in Chemistry with a minor in Math from Millersville University, PA. She also has received ACS Analytical Chemistry Award.
“We are delighted to welcome Kevin & Sharon as key members of the Micross team and look forward to leveraging their knowledge & skills to better serve our markets as we continue to grow,” stated Mac Blythe, General Manager of Micross CMS. “Their experience and expertise within the Semiconductor and Aerospace/Defense markets will further advance the organization in delivering continuous quality and operational improvements and ensure that we can meet our customers’ stringent requirements,” he added. “In addition, they are proven problem solvers and will enhance the value that Micross can deliver to customers.”
Micross CMS offers the most comprehensive range of capabilities available from one source including: BGA Reballing, GEIA-STD-0006 Robotic Hot Solder Dipping & Exchange, Lead Attach, Trim & Form, Counterfeit Mitigation Testing and Tape & Reel Services. For additional information about Micross Component Modification Services, visit http://www.micross.com or contact sales(at)micross.com
About Micross
Micross is the global one-source provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for more than 40 years, our extensive hi-reliability capabilities serve the Aerospace & Defense, Space, Medical and Industrial markets. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle.
Micross Corporate Contact:
Valerie Thomas, Director of Marketing Communications
Valerie.thomas(at)micross.com
Valerie Thomas, Micross Components, 4072965664, [email protected]
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