Micross Exhibiting at IMAPS Boston, Booth 230 - October 1-2, 2019

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Micross to Showcase Advanced Packaging Solutions plus Hi-Rel Microelectronic Products & Services At IMAPS 2019 Boston, Booth 230

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Orlando, Florida, September 26, 2019 -- Micross is excited to once again exhibit at IMAPS 52nd International Symposium on Microelectronics, October 1-2, 2019, in Boston.

The International Microelectronics Assembly & Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.

Micross will showcase its hi-reliability microelectronic capabilities inclusive of:

  • Bare Die & Wafer Processing

Broadest Access to Bare Die 30+ Manufacturers

  • Advanced Interconnect Technologies

Wafer Bumping / Wafer-Level Packaging / 3D Integration

  • Packaging & Assembly

Optoelectronic & Silicon Photonics Assembly / FlipChip / MCM / SiP

  • Component Modification

BGA Reballing / Lead Attach / Column Grid Array (CGA)

  • Advanced Testing Services: Electrical & Environmental Test

FPGA, ASIC, RF Test / Life Test & Burn-in / PEMs-COTS Screening & Qualification

  • Hi-Rel Products

SMD/5962 & Hi-Rel Memory, Analog & Power

We look forward to speaking with you about your specific packaging needs and to answering any other questions you may have about our broad range of products and services.

For additional information about Micross or to request a quote, please visit our website at: http://www.micross.com or email: sales@micross.com

In business for 40+ years, Micross has remained committed to delivering a complete range of Hi-reliability microelectronic components and services to Aerospace & Defense, Space, Industrial and Commercial customers to support mission-critical requirements. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle.

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Valerie Thomas
Micross Components
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