Micross to Showcase Hi-Rel Microelectronic Products & Services at Electronica 2018 Munich

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Micross is excited to once again participate at electronica 2018, November 13-16, in Munich, Germany.

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electronica 2018

Micross is excited to once again participate at electronica 2018, November 13-16, in Munich, Germany. Micross will showcase all of its hi-reliability capabilities inclusive of:

  •     Bare Die & Wafer Processing

Broadest Access to Bare Die 30+ Manufacturers

  •     Advanced Interconnect Technology

Wafer Bumping / Wafer-Level Packaging

  •     Packaging & Assembly

Optoelectronic & Silicon Photonics Assembly

  •     Component Modification

BGA Reballing / Column Grid Array (CGA)

  •     Advanced Testing Services: Electrical & Environmental Test

FPGA, ASIC, RF Test / Life Test & Burn-in

  •     Hi-Rel Products

SMD/5962 & Extended Temp. Plastic

electronica 2018
Visit Micross in Hall C5, Stand 436 to enter our daily stand raffle. For more information about Micross’ presence at electronica, visit https://www.micross.com/electronica-2018/

About Micross
Micross is the one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for more than 40 years, our comprehensive array of hi-reliability capabilities serve the global Defense, Space, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle. For additional information, visit http://www.micross.com

Micross Corporate Contact:
Valerie Thomas, Director of Marketing Communications
Valerie.thomas@micross.com

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Valerie Thomas
Micross Components
4072965664
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