ORLANDO, Fla. (PRWEB) November 08, 2018 -- Micross is excited to once again participate at electronica 2018, November 13-16, in Munich, Germany. Micross will showcase all of its hi-reliability capabilities inclusive of:
• Bare Die & Wafer Processing
Broadest Access to Bare Die 30+ Manufacturers
• Advanced Interconnect Technology
Wafer Bumping / Wafer-Level Packaging
• Packaging & Assembly
Optoelectronic & Silicon Photonics Assembly
• Component Modification
BGA Reballing / Column Grid Array (CGA)
• Advanced Testing Services: Electrical & Environmental Test
FPGA, ASIC, RF Test / Life Test & Burn-in
• Hi-Rel Products
SMD/5962 & Extended Temp. Plastic
electronica 2018
Visit Micross in Hall C5, Stand 436 to enter our daily stand raffle. For more information about Micross’ presence at electronica, visit https://www.micross.com/electronica-2018/
About Micross
Micross is the one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for more than 40 years, our comprehensive array of hi-reliability capabilities serve the global Defense, Space, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, test and logistics expertise needed to support an application throughout its entire program cycle. For additional information, visit http://www.micross.com
Micross Corporate Contact:
Valerie Thomas, Director of Marketing Communications
[email protected]
Valerie Thomas, Micross Components, 4072965664, [email protected]
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