NexLogic Technologies, Inc. Announces the Installation of Three Major Microelectronics Manufacturing Systems

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NexLogic Technologies, Inc. has announced the purchase and installation of three major machines to augment its offerings in the field of microelectronics to its customers worldwide. These three systems include a HESSE Bondjet 820 and two Mycronic MRSI 705 systems.

Mycronic MRSI 705 system

NexLogic President and Founder, Zulki Khan said, "...More recently, customers and their product innovations call for a combination of traditional SMT manufacturing and the newly emerging microelectronics manufacturing..."

NexLogic Technologies, Inc. has announced the purchase and installation of three major machines to augment its offerings in the field of microelectronics to its customers worldwide. These three systems include a HESSE Bondjet 820 and two Mycronic MRSI 705 systems.

The Hessee BJ820 is a high speed, fully automatic and extremely accurate fine wire wedge bonder and uses wires and ribbons made of aluminum, copper, and gold. Typical applications are components in the HF and RF technology, chip on board (CoB), and multi-chip module (MCM).

The two MRSI-705 machines are 5-micron die bonders. Each features +/- 5 microns for better placement accuracy, a requirement for critical applications. The linear motors deliver faster speeds with better settling times and overall smoother motion. Reliability is enhanced through the use of advanced air bearing technology in the Z axis.

NexLogic President and Founder, Zulki Khan said, "We've been in business for almost a quarter century serving OEMs in the Bay Area and beyond. More recently, customers and their product innovations call for a combination of traditional SMT manufacturing and the newly emerging microelectronics manufacturing. This means we must stay ahead of these new PCB assembly and manufacturing technologies to comply with customer demands."

In the last year, NexLogic has made CAPEX investments including a new Class 10,000 cleanroom, and has hired fully trained personnel to comply with this growing industry demand. A HESSE BJ820 fully automatic fine wire bonder is at the forefront of NexLogic's microelectronics manufacturing systems. It is capable of ball, wedge, and wire bonding using aluminum, copper, or gold wires.

A Janome JR3303 Robotic level flux and epoxy dispenser, TPT-HB16 Wire/Ball Bonder, Royce 620 Multi-test Bond Tester and sheer strength puller, and Keyence VK-X1000 Profile Measurement Microscope for wire bond inspection and verification system complement the HESSE fine wire bonder.

About NexLogic Technologies, Inc.
1995- 2019 24th anniversary year and selected among the Top 10 EMS Providers in Silicon Valley - https://www.ventureoutsource.com/contract-manufacturing/top-10-ems-providers-in-california-silicon-valley-bay-area-2017/

An ISO 9001:2008, ISO 13485 Certified, and RoHS compliant EMS provider, NexLogic is a leading electronic manufacturing services provider that offers total integrated circuit board solutions. The company was established in 1995 and serves over 200 customers in North America. NexLogic's mission is to be the best electronic manufacturing services (EMS) provider to the markets it serves through high quality and an efficient manufacturing process.

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Dan Garza
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