Telink Semiconductor Appointed to the Bluetooth® Special Interest Group Board of Directors
Telink Semiconductor is pleased to announce that co-founder Haipeng Jin has been appointed to the Board of Directors of the Bluetooth® Special Interest Group (SIG). Haipeng will serve a two-year term on the board, which plays a pivotal role in driving the expansion of Bluetooth technology into a growing number of consumer and commercial markets.
SANTA CLARA, Calif., July 17, 2019 /PRNewswire-PRWeb/ -- Telink Semiconductor is pleased to announce that co-founder Haipeng Jin has been appointed to the Board of Directors of the Bluetooth Special Interest Group® (SIG). Haipeng will serve a two-year term on the board, which plays a pivotal role in driving the expansion of Bluetooth technology into a growing number of consumer and commercial markets.
"The addition of Telink's Haipeng Jin to the Bluetooth SIG Board of Directors is an honor, and we look forward to Haipeng's expertise and creativity," says Bluetooth SIG Executive Director Mark Powell. "Bluetooth's rapid growth has enabled a variety of commercial and industrial solutions, including connected lighting, asset tracking, and access control. The expertise Telink provides will be hugely beneficial as Bluetooth continues to add capabilities and evolve to meet market demands."
From mesh networking compatibility to long-range transmitters to angle-based direction finding, each successive iteration of the Bluetooth specification introduces a host of new capabilities enabling greater innovation. There are multiple exciting on-going projects within the SIG to help strengthen the leading position of Bluetooth in the IoT arena, and Telink looks forward to contributing to the evolution of Bluetooth technology with this appointment.
"We are honored by Haipeng's appointment to the Bluetooth SIG Board of Directors," says Telink CEO, Dr. Wenjun Sheng. "Telink is among the fastest growing semiconductor companies in the world, and our Bluetooth-based chip is one of the pillars of our product portfolio. We see immense potential for Bluetooth to become one of the most ubiquitous low-power wireless Internet of Things technologies."
Haipeng is joining a board formed with individuals from some of the world's best-known technology and product companies: Apple, Bose, Ericsson AB, Intel, Microsoft, Motorola Mobility (a subsidiary of Lenovo), Nokia, and Toshiba.
ABOUT TELINK: Founded in 2010, Telink Semiconductor is a fabless integrated circuit design company with offices in Santa Clara, Hong Kong, London, Ningbo, Shanghai, Shenzhen, and Taipei. Telink is dedicated to the development of highly integrated low-power radio-frequency and mixed signal system chips for Internet of Things applications. Telink's product portfolio is aimed at serving markets ranging from smart lighting to home automation to smart cities, and currently includes 2.4Ghz RF SoCs for Bluetooth Smart, Zigbee, 6LoWPAN/Thread, and Homekit.
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SOURCE Telink
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