Vincent Buffa, Chairman of Micross Holdings, Named CEO of Micross Components, Inc.
Micross Holdings announced that Vincent M. Buffa (Vince) has been appointed CEO of Micross Components in addition to his role of Chairman of Corfin Industries and Micross Holdings.
MELVILLE, N.Y., and ORLANDO, Fla., July 30, 2020 /PRNewswire-PRWeb/ -- Micross Holdings announced that Vincent M. Buffa (Vince) has been appointed CEO of Micross Components in addition to his role of Chairman of Corfin Industries and Micross Holdings. Micross is the leading global supplier of turnkey high-reliability microelectronic services and products for the defense, space, commercial aerospace, medical and severe-duty industrial applications.
Vince brings over 32 years of sales, engineering and manufacturing expertise with highly-engineered products in aerospace and industrial markets to his leadership role at Micross. Previously, Vince was President and CEO of Data Device Corporation, a market leader in highly complex electronics for data connectivity, power management and motion control. Vince led the business through a successful build up and expansion mandate with Behrman Capital ending in a successful $1B transaction with Transdigm, Inc.
Most recently, Vince led the turnaround and go-to-market plan for HDT Global, a $400M leader in expeditionary and infrastructure solutions for the defense, government and commercial markets. Earlier in his career, he has held senior leadership roles including President, General Manager, VP of Operations and Business Units Director with Honeywell, Crane, Rexnord and Harris Corporation.
His areas of expertise include business transformation & Hoshin Planning, Six Sigma and Lean; driving global manufacturing strategies, supply chain optimization and continuous performance improvement. Throughout his career, Vince has successfully worked with diverse teams in North America, Europe and Asia. His experience includes Avionics Systems, Defense Electronics, Environmental Control Systems, Expeditionary Infrastructure Solutions, Industrial pumps, valves and flow control products for the Petrochemical, Oil & Gas and high-end Industrial market applications. Vince holds a Bachelor of Engineering Degree in Electrical Engineering from Purdue and an MBA with a concentration in Finance from Hofstra University.
"I am excited to be leading the team at Micross working closely with the Micross Components and Corfin Industries leadership teams. We have combined two industry-leading market players in the defense microelectronics business segment. Micross is uniquely positioned to provide the "one source, one solution" service to the aerospace, defense and space market primes and system providers. I am fully committed to providing our customers with a value proposition that meets and exceeds their requirements for high-reliability microelectronics applications. We are focused on providing our customers with best-in-class lead-times, on-time delivery and providing high-quality products and services", said Vincent Buffa, Micross Chairman and CEO.
"Vince's proven track record in the defense electronics market and with complex manufacturing/engineering companies makes him the ideal executive to lead Micross to the next level. We are looking forward to Vince's contributions to Micross and bringing his focus on business strategy and operational excellence to all aspects of the business for further value creation," according to Grant Behrman, Managing Partner at Behrman Capital.
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About Micross
Micross (https://www.micross.com) is the global one-source provider of mission-critical microelectronic components and services, including Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. In business for more than 40 years, Micross' extensive hi-reliability capabilities serve the Aerospace & Defense, Space, Medical and Industrial markets, among others. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle.
About Behrman Capital
Based in New York City and San Francisco, Behrman Capital was founded in 1991 by Grant G. and Darryl G. Behrman. The firm invests in management buyouts, leveraged buildups and recapitalizations of established growth businesses. The company's investments are focused in three industries: defense and aerospace, healthcare services, and specialty manufacturing and distribution. The firm has raised in excess of $3.0 billion since inception and is currently investing out of its sixth fund. For more information, please visit http://www.behrmancap.com
Media Contact:
Valerie Thomas, Micross Components
[email protected]
Source: Micross Components, Inc.
Related Links: https://www.micross.com
SOURCE Micross Components
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