YES (Yield Engineering Systems, Inc.) SVP Dr. Zia Karim to Deliver ECTC Paper on Results of Joint Research with HD MicroSystems

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Investigators Studied PI Film Outcomes under Various Process Conditions

Yield Engineering Systems
“Working jointly with YES, we were able to understand the effect of vacuum cure on our industry standard HD-4100 polyimide, HD8820 PBO and low-temperature cure HD-7110. ” said Ron Legario, Technical Service Manager for HD Microsystems.

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for the semiconductor advanced packaging, life sciences and “more-than-Moore” markets, today announced that Zia Karim, Ph.D., the company’s Senior VP and CMO, Business Development and Strategic Marketing, will present an ECTC paper next month detailing the company’s work with HD MicroSystems to characterize the performance of three polyimide films under a range of process conditions.

“Working jointly with YES, we were able to understand the effect of vacuum cure on our industry standard HD-4100 polyimide, HD8820 PBO and low-temperature cure HD-7110. We found that vacuum cure is a viable alternative to atmospheric cure of these products and provided benefits in thermal properties and potential for enhanced productivity,” said Ron Legario, Technical Service Manager for HD Microsystems.

“Using vacuum cure, we were able to demonstrate better outgassing, thermal and electrical properties for these films compared to atmospheric methods, with better CoO to support customers’ roadmap to cost-effective heterogeneous integration and 3D stacking solutions,” said Dr. Karim. “I look forward to sharing our findings with the ECTC community during technical session 7: Advances in Packaging at the Wafer/Panel Level.” The ECTC 2020 virtual conference, of which YES is a sponsor, will be accessible free of charge from June 3 through June 30 at

The companies conducted their joint research using YES’s flagship product, the VertaCure vacuum curing system, which provides significant benefits for next-generation advanced packaging. Typical VertaCure applications are polyimide or PBO cure, wafer-to-wafer bonding anneal, vacuum anneal, and pre-metal or pre-PVD bake and degas.

About YES
YES (Yield Engineering Systems, Inc.) is a leading manufacturer of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include high-temperature vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in the San Francisco Bay Area with offices in Livermore and Fremont, and a growing presence globally. For more information about YES, please visit

About HD Microsystems
Founded in 1997, HD MicroSystems (HDM) is a 50-50 joint venture of the Hitachi Chemical Company and DuPont. HD MicroSystems is the world’s largest supplier of polyimide and PBO precursor chemistries specifically engineered for microelectronic applications. When applied and cured, these materials transform into polyimide and PBO films with unique end use properties. HDM's product line is broad, consisting of photosensitive coatings, standard non-photosensitive coatings, high temperature adhesives, optically clear coatings and a full line of complementary ancillary products.

About ECTC

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies.

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Victoria Barnes
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