This study has important implications for the growing number of 3D stacking applications where thermal budget is limited.
FREMONT, Calif. (PRWEB) October 13, 2020
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for the semiconductor advanced packaging, life sciences and “more-than-Moore” markets, today announced that Zia Karim, Ph.D, the company’s Senior VP and CMO, Business Development and Strategic Marketing, will present a paper at IWLPC illustrating how the choice of cure process affects cure time and film properties for low-temperature polyimides.
“The paper examines thermal, mechanical, and dielectric properties for low temperature polyimides as a function of cure parameters using YES’s VertaCure XP system. We were able to demonstrate better properties as well as at least 35% lower CoO for these polyimides when cured under vacuum, as compared to atmospheric methods,” said Dr. Karim. “This study has important implications for the growing number of 3D stacking applications where thermal budget is limited. I look forward to sharing our findings with the IWLPC community.” Dr. Karim’s presentation is #365 in the conference’s 3D Integration track. It will be accessible on demand from October 13 – 30 at http://www.iwlpc.org.
The research for the paper was conducted using YES’s flagship product, the VertaCure XP vacuum curing system, which provides significant benefits for next-generation advanced packaging. Typical VertaCure applications are polyimide or PBO cure; wafer-to-wafer bonding anneal; vacuum anneal; and pre-metal or pre-PVD bake and degas.
YES (Yield Engineering Systems, Inc.), a gold-level sponsor of IWLPC 2020, is a leading manufacturer of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Silicon Valley, with offices in Fremont and a growing presence globally. For more information about YES, please visit http://www.yieldengineering.com.
The International Wafer-Level Packaging Conference (IWLPC) is now in its 17th successful year as a well-established international conference, boasting annual representation from over 19 countries. The technical program and exhibition focus on semiconductor packaging and advanced wafer-level packaging technology, featuring three tracks: WLP, 3D Integration, and Advanced Manufacturing and Test. This year’s virtual conference is a continuation of “Bridging the Boundaries: Wafer, Panel and Beyond,” reflecting the enablement of 5G communications, AI, and IoT, automotive and more.