Cornell University Autonomous Underwater Vehicle Powered by ADLINK’s Express-HL COM Express® Module Attempts Three-peat
San Jose, CA (PRWEB) July 24, 2014 -- ADLINK Technology, a leading global provider of cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), today announced its sponsorship of the Cornell University Autonomous Underwater Vehicle (CUAUV) team’s entry into next week’s 17th Annual International RoboSub competition held at the Space and Naval Warfare Command Research facility in San Diego, CA, from Monday, July 28, through Sunday, August 3.
The CUAUV’s Gemini submarine is powered by ADLINK’s Express-HL COM Express® computer-on-module, featuring a 4th generation quad-core Intel® Core™ i7 processor with Mobile Intel® QM87 Express chipset. The Express-HL acts as Gemini’s lone on-board computer, tasked with all vision processing and decision-making required by the AUV. In addition, the Express-HL COM Express carrier board runs its own controller, as well as communicating with micro-controllers on several custom-built peripheral circuit boards also included in Gemini’s design.
“When we started designing Gemini back in August (2013), we knew that we wanted something smaller and more powerful than the 3rd generation Intel Core i7 processor on Mini-ITX form factor that we used on our 2013 vehicle,” explained Markus Burkardt, CUAUV team leader and Cornell University senior. “We decided that a quad-core computer-on-module was the best option to reduce overall vehicle weight and footprint without giving up performance, so we started contacting vendors for support. We were really happy when ADLINK agreed to be our sponsor.”
The CUAUV team, made up of 43 students from three of Cornell’s colleges, spends more than 20,000 person-hours per year designing its vehicle and has won the annual RoboSub competition four out of the last five years. The team began testing Gemini in pool and lake waters back in June, performing and perfecting anticipated manipulation tasks for the mission elements included in the competition’s obstacle course.
“ADLINK is proud to help with the efforts of such a dedicated and successful group of engineers,” said Elizabeth Campbell, general manager of ADLINK, North America. “The skills they are developing now will directly translate into the design of autonomous vehicles that are critical to many industries, including factory automation, geographic exploration, wildlife and environment preservation, and – of course – national defense.”
ADLINK’s Express-HL is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 4th Generation Intel® Core™ i7/i5/3 or Celeron® processor with CPU, memory controller, and graphics processor on the same chip, and is specifically designed for customers who need high-level processing and graphics performance in a long product-life solution. The Express-HL supports Intel® Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR3 dual-channel memory at 1333/1600 MHz to provide excellent overall performance. Intel® Flexible Display Interface and Direct Media Interface (DMI) provide high-speed connectivity to the Intel® QM77or HM86 Express chipset.
The international RoboSub competition is co-sponsored by the Association for Unmanned Vehicle Systems International (AUVSI) Foundation and the U.S. Office of Naval Research (ONR) with the goal of advancing the development of AUVs. The event serves to foster ties between young engineers and organizations developing AUV technologies. The competition mission elements and tasks are designed to simulate real-world challenges, such as visual recognition of objects, navigation, and acoustic sensing.
For more information on this year’s RoboSub competition, please visit:
http://www.auvsifoundation.org/foundation/competitions/robosub/
For more information on the CUAUV team, please visit http://www.cuauv.org/
For more information on ADLINK’s extensive link of computer-on-modules, including the Express-HL, please visit: http://www.adlinktech.com/Computer-on-Module/index.php
About ADLINK
ADLINK Technology is enabling the Internet of Things (IoT) with innovative embedded computing solutions for edge devices, intelligent gateways and cloud services. ADLINK’s products are application-ready for industrial automation, communications, medical, defense, transportation, and infotainment industries. Our product range includes motherboards, blades, chassis, modules, and systems based on industry standard form factors, as well as an extensive line of test & measurement products and smart touch computers, displays and handhelds that support the global transition to always connected systems. Many products are Extreme Rugged™, supporting extended temperature ranges, shock and vibration.
ADLINK is a Premier Member of the Intel® Internet of Things Solutions Alliance and is active in several standards organizations, including PCI Industrial Computer Manufacturers Group (PICMG), PXI Systems Alliance (PXISA), and Standardization Group for Embedded Technologies (SGeT).
ADLINK is a global company with headquarters in Taiwan and manufacturing in Taiwan and China; R&D and integration in Taiwan, China, the US, and Germany; and an extensive network of worldwide sales and support offices. ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified and is publicly traded on the TAIEX Taiwan Stock Exchange (stock code: 6166).
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Intel, Core, and Celeron are registered trademarks of Intel Corporation in the United States and other countries.
Monica Lanctot, ADLINK Technology, Inc., http://www.adlinktech.com, +1 (408) 360-4337, [email protected]
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