Silicon Etching Systems and Semiconductor Dry Etching Market 2014 – 2018 Global Analysis Report at Sandlerresearch.org
Dallas, Texas (PRWEB) January 27, 2014 -- Currently, vendors in the market are focusing on manufacturing miniaturized personal electronic products that consume less power. As a result of this, semiconductor foundries are focusing on aspects such as integrating different features, reducing the size of semiconductor wafers, and lowering IC power consumption. Therefore, the usage of silicon etching systems is increasing in the market.
Analysts forecast the Global Silicon Etching Systems market (http://www.sandlerresearch.org/global-silicon-etching-systems-market-2014-2018.html) to grow at a CAGR of 3.59 percent over the period 2013-2018. According to the report, one of the major drivers for this growth is the rising demand in emerging markets for smartphones and tablets, which use semiconductor wafers.
Further, the report states that one of the key challenges is the cyclical nature of the semiconductor industry as a result of which silicon etching systems manufacturers often experience fluctuations in revenues, which adversely affect profitability.
The Global Silicon Etching Systems Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, the Americas, and the EMEA region; it also covers the Global Silicon Etching Systems market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.
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The report recognizes the following companies as the key players in - Global Silicon Etching Systems Market: Lam Research Corp., Hitachi High-Technologies Corp., Applied Materials Inc., and Tokyo Electron Ltd.
Other vendors mentioned in the report are Axcelis Technologies Inc., FSI International Inc., GlobalFoundries Inc., Intel Corp., JUSUNG Engineering Co. Ltd., Mattson Technology Inc., SEMES Co. Ltd., Samsung Semiconductor Inc., Semiconductor Manufacturing International Corp., Taiwan Semiconductor Manufacturing Co. Ltd., and United Microelectronics Corp.
Global Semiconductor Dry Etching Market 2014-2018 (http://www.sandlerresearch.org/global-semiconductor-dry-etching-market-2014-2018.html): Analysts forecast the Global Semiconductor Dry Etching Equipment market to grow at a CAGR of 2.27 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing demand for smart electronic devices. The Global Semiconductor Dry Etching Equipment market has also been witnessing the growing need for miniaturization of electronic circuits. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market.
The Global Semiconductor Dry Etching Equipment Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC and EMEA regions, and the Americas; it also covers the Global Semiconductor Dry Etching Equipment market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.
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Key vendors dominating this space are APPLIED materials Inc., Hitachi High-Technology Corp., Lam Research Corp., and Tokyo Electron Ltd.
Other vendors mentioned in the report are Jusung Engineering Co. Ltd, Mattson Technology Inc., ULVAC Technologies Inc., and Semes Co. Ltd.
Key questions answered in this report:
• What will the market size be in 2018 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
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Priyank Tiwari, Sandlerresearch.org, http://www.sandlerresearch.org/, +1 (888) 391-5441, [email protected]
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