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Carsem Receives Microsemi Corporation’s Best Supplier of the Year Award for 2010

Wed, 22 Jun 2011 07:00:00 GMT

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that, for the second year in a row, it has received Microsemi Corporation's Best Supplier of The Year Award for assembly and test services that were provided by the Carsem factory located in Suzhou, China.

(PRWeb June 22, 2011)

Read the full story at http://www.prweb.com/releases/2011/6/prweb8586425.htm

Carsem Expanding Suzhou Factory MLP (QFN) Capacity

Thu, 26 May 2011 07:00:00 GMT

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they are expanding their Suzhou, China factory size by an additional 40,000 square meters (430,000 square feet). The ground breaking for the new facility expansion commenced in Q1 2011 and production operations are expected to begin in Q1 2012. The expansion will bring the total factory size to 56,000 square meters (600,000 square feet) and will allow Carsem to increase their Suzhou factory Micro Leadframe Package (MLP) capacity from the current 5 million units per day to over 20 million per day.

(PRWeb May 26, 2011)

Read the full story at http://www.prweb.com/releases/2011/5/prweb8480554.htm

Carsem Receives Richtek’s 2010 Best Supplier Award

Tue, 22 Feb 2011 08:00:00 GMT

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received Richtek’s 2010 Best Supplier Award in recognition of outstanding services that were provided by the Carsem factory located in Suzhou, China.

(PRWeb February 22, 2011)

Read the full story at http://www.prweb.com/releases/2011/2/prweb8151198.htm

Carsem’s W. L. Law Receives Best Industry Paper Award at IEMT Conference

Thu, 16 Dec 2010 08:00:00 GMT

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that W. L. Law, Carsem’s R&D Manager, received the Best Industry Paper Award at the 34th International Electronics Manufacturing Technology (IEMT) Conference held in Melaka, Malaysia from November 30 through December 2, 2010. The conference was sponsored by the Institute of Electrical and Electronics Engineers (IEEE) and the Components, Packaging, & Manufacturing Technology (CPMT) Society and is held every two years.

(PRWeb December 16, 2010)

Read the full story at http://www.prweb.com/releases/2010/12/prweb8026024.htm

Carsem Continues to Aggressively Expand MLP (QFN) Capacity

Tue, 24 Aug 2010 07:01:00 GMT

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they are continuing to aggressively expand their MLP (QFN) manufacturing capacity in both their Ipoh, Malaysia and Suzhou, China factory locations and are now capable of producing over 11 million units per day. This capacity expansion in assembly is matched with an equal proportion of test capacity expansion.

(PRWeb August 24, 2010)

Read the full story at http://www.prweb.com/releases/2010/08/prweb4417334.htm

Carsem Wins ITC Patent Litigation Case

Thu, 22 Jul 2010 07:01:00 GMT

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it was determined by the International Trade Commission (ITC) that Carsem has not violated section 337 of the Tariff Act of 1930, 19 U.S.C. & 1377, in the on-going patent litigation with Amkor Technology regarding ITC’s Investigation No. 337-TA-501

(PRWeb July 22, 2010)

Read the full story at http://www.prweb.com/releases/2010/07/prweb4287624.htm

Carsem Receives Supertex 2009 Excellence Award

Tue, 22 Jun 2010 07:00:00 GMT

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that it has received a 2009 Supplier Excellence Award from Supertex, Inc. for assembly and test services that were provided by the Carsem factory located in Suzhou, China. The award is based on Supertex’s exacting standards in the areas of yield, quality and delivery performance.

(PRWeb June 22, 2010)

Read the full story at http://www.prweb.com/releases/2010/06/prweb4169364.htm

Carsem Expands Extremely Thin MLP Capacity at Suzhou Factory

Wed, 05 May 2010 07:00:00 GMT

Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced today that they are significantly expanding their Suzhou, China factory’s manufacturing capacity for the new X3 package.

(PRWeb May 05, 2010)

Read the full story at http://www.prweb.com/releases/Carsem/MLP-x3-package/prweb3963114.htm

Carsem Receives 'No Violation' Decision in Patent Litigation Case

Thu, 25 Mar 2010 07:00:00 GMT

An Administrative Law Judge (ALJ) has issued a Supplemental Initial Determination (ID) in Carsem's on-going patent litigation with Amkor Technology in the U.S. International Trade Commission (ITC) in Washington, D.C. Following the Commission’s Notice of Reversal and Remand that was issued in February this year, the ALJ has now determined that all of Amkor’s asserted patent claims are invalid, not infringed, and/or not enforceable at the ITC, and that Carsem has not violated Section 337 of the Tariff Act by importing the MLP products Amkor had accused of infringement.

(PRWeb March 25, 2010)

Read the full story at http://www.prweb.com/releases/2010/03/prweb3774204.htm